Electronics Forum | Fri Mar 19 09:22:32 EDT 2010 | mun4o
Hi, most of them are MSL 3.There are MSL 4 and 2a.Most of defective LEDs are 3528 footprint.The thermoprofile is Ok??
Electronics Forum | Fri Mar 30 14:47:27 EDT 2007 | GS
MSL 3) By SAM (Scanning Acoustic Microscope) before to remove them from PCB, you could identify if de-laminated or not and the degree of delamination. Best Regards...GS
Electronics Forum | Mon Jan 21 16:13:50 EST 2008 | arun2382
We see delamination at Mold compound to substrate interface when tested for MSL3. We haven't tested the substrate for cleanliness. Can you please suggest methods for this? thanks, arun
Electronics Forum | Wed Apr 16 02:40:57 EDT 2008 | andrzej
hello, I found on label two information about MSL level : MSL-2 - 240C MSL-3 - 260C Does it corresponds to SnPb and Pb-free ?
Electronics Forum | Tue Jan 12 11:35:55 EST 2010 | stepheniii
We have been receiving LEDs in these type of bags. The HIC says they are good. But we don't want to find out that there is a problem, at test or by customer returns. Does anyone reject them at receiving as not properly packaged when the parts are
Electronics Forum | Thu Dec 09 02:27:41 EST 2010 | fönsi
Hi Dave! Thank you very much for your effort. So then we will try to increase humidity to about 40 percent rel. I think, we won't increase it to more than 40 percent because of the MSL-3 components. regards
Electronics Forum | Wed Jan 14 12:48:55 EST 2015 | dyoungquist
MSL rating is not tied to a specific package type/size. I have seen 2 components (ICs) have the same physical package but one was MSL-3 while the other was MSL-5. From my experience, while component manufacturers are not consistent as to where they
Electronics Forum | Wed Jan 17 11:30:23 EST 2007 | Colleen Miller
We have some larger MSL3 parts that require baking. they are 6mm thick which takes them off the chart provided at http://www.jedec.org/download/search/jstd033a.pdf Does anyone have a reference that would tell me the baking times for these component
Electronics Forum | Fri Aug 24 12:20:41 EDT 2007 | petep
I have an MSL3 part (a relay) supplied in tape and reel. From what I am able to determine, these parts require baking at 257 degrees F for a minimum of 8 hours once the integrity of the seal is broken for over 168 hours. How are parts baked at th
Electronics Forum | Wed Dec 19 14:02:18 EST 2007 | gersla
We decided to bake components in tray package at 70 Degree prior soldering. I am looking for suggestion regarding baking time for MSL3 components: Up to 1.4mm package thickness 1.4-2 mm thickness 2-4.5 mm thickness In JEDEC-033B this temperature is n
