Industry Directory | Consultant / Service Provider
A professional and specialized company in automatic Control fields Design, maintenance and upgrade all machines Maintenance of various electeonic cards using computer and modern instruments Design of various electronic circuits including microcontrol
Industry Directory | Distributor / Manufacturer / Other
Sale, Trade in, repair and refurbish any industrial electronics card
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
New Equipment | Assembly Services
SMT board loading machine parameters It has the advantages of simple operation, reliable structure, excellent material selection and high quality. Product specification: weight: 65kg Power supply voltage: single 220 V (or 110 V) Power: ≤ 50W
Electronics Forum | Wed May 22 13:25:45 EDT 2002 | melsolutions
There is a system that Sony uses called Timms. This system has been used worldwide at Sony Electronics manufacturing facilities for over 12 years. They are selling the software package to customers now as a whole full functional product. They have
Electronics Forum | Wed Jun 20 16:03:01 EDT 2001 | Gil Zweig
The multi-layer printed circuit board manufacturers have been using x-ray inspection for many years to quality control drilling and lamination of multi-layers. Assemblers should consider using x-ray for incoming quality control from their multi-layer
Used SMT Equipment | SMT Equipment
Product name: YS88 multi-function module chip mounter Product number: YS88 Products in detail The characteristics of Configurable ~ 0402 chip - 55 mm components, the wide range of special-shaped long joint element The height of the object elem
Used SMT Equipment | Pick and Place/Feeders
Product number: YS88 Products in detail The characteristics of Configurable ~ 0402 chip - 55 mmcomponents, the wide range of special-shaped long joint element The height of the object elementcorresponds to 25.5 mm 10 ~ 30 n can be easy to stick
Industry News | 2016-11-07 16:28:47.0
GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations.
Industry News | 2022-10-04 11:37:37.0
MIRTEC is pleased to announce plans to exhibit at SMTA International, scheduled to take place Nov 2-3, 2022 at the Minneapolis Convention Center in Minnesota. The MIRTEC team is looking forward to meeting with attendees at booth #906 for a detailed demonstration of its MV-6Z OMNI 3D In-Line AOI system.
Parts & Supplies | Pick and Place/Feeders
YAMAHA KLA-M5890-07 HEAD SERVO UNIT ASSY FOR YSM20R YSM20W YAMAHA KHN-M4530-03 YG12/YS12/YS24 IF board in the control box KHN-M4530-551/KHN-M4530-02 REMOTE IF BOARD ASSY KHN-M4530-03 REMOTE IF BOARD ASSY KHN-M4530-35 REMOTE IF BOARD ASSY KHN-M
Parts & Supplies | Assembly Accessories
KHN-M5840-50 Z SERVO BOARD ASSY 30KW(TOTAL) 3&200v 0~375HZ YS12, YS24 Chassis Servo Board KHN-M5840-525 Servo Control Board (Small Power Servo Board ) KHN-M5840-50 SERVO BOARD&n
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
http://www.gpd-global.com GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations. The same automated fluid dispensing machine is capable of dispensing fluids and also Pick & Place simple compo
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Thu Mar 25 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | ,
Webinar: Process Control to Ensure Electrochemically Reliable Electronics
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Career Center | Chanhassen, Minnesota USA | Maintenance
Quantum Controls, Inc is looking for a manufacturing technician to maintain and repair our electronics assembly equipment. We seek a highly organized multi-tasker, skilled in troubleshooting, with strong electro-mechanical aptitude.� Seeking FT ap
Career Center | Raleigh, North Carolina USA | Quality Control
Director of Quality responsible for multiple facilities within an SMT electronics manufacturing operation. Must be willing to travel, coordinating quality systems, philosophies, and direction to other locations. Will play an instrumental role in la
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
KingFei SMT Tech | https://www.smtspare-parts.com/sale-37277110-n510002593aa-control-unit-mr-j2s-60b-s041u638-cm602-x-axis-driver.html
: CM602 Machine Name: X Axis Servo Driver Country: Japan High Light: CM602 X Axis Driver , MR-J2S-60B-S041U638X Axis Driver , N510002593AA X Axis Servo Driver N510002593AA Control Unit MR-J2S-60B-S041U638 CM602 X Axis Driver Description: 1, Original Place: Japan 2, Part Name
ASCEN Technology | https://www.ascen.ltd/Blog/machine/Conformal_coating_machine/1003.html
Multi-axis PCB conformal coating equipment CF-450 model Main Features: 1.Structure applies to the thickness steel ,much more stable, and no shaking . 2
