Industry Directory: multilayer bonding (3)

Midwest Printed Circuit Services, Inc.

Industry Directory | Manufacturer

MPCS is a 100% American made PCB supplier. A technology leader in the manufacture of high reliability printed circuit boards. From simple product to high layer count multilayers, flex, rigid-flex, heat sinks and metal cores.

Re-Source Direct, Inc. (Asian Supply Chain Management Team)

Industry Directory | Manufacturer

We guarentee to lower your product cost! With over 15 years experience, we are DIRECT CONTACTS of select Asian manufacturing companies and factories from The People's Republic of China, Philippines, and Hong Kong. This select group is well-established manufacturing experts within their industries. We have long term relations with each

New SMT Equipment: multilayer bonding (17)

Qualification of Bare Boards

Qualification of Bare Boards

New Equipment | Test Services

Qualification of boards and assemblies is the comparison of the board or assembly to an industry standard. Specifically, we qualify printed circuit boards to IPC-6012 – Qualification and Performance Specifications for Rigid Printed Boards and

ACI Technologies, Inc.

China 0.2mm BGA multilayer pcb manufacturer

China 0.2mm BGA multilayer pcb manufacturer

New Equipment | Fabrication Services

Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a high quality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board 

Shenzhen Kingsheng PCBA Tech CO.,Ltd.

Electronics Forum: multilayer bonding (24)

Ag/Pd termination reflow soldering issues

Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef

Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c

Re: Multilayer PTFE Boards

Electronics Forum | Mon Dec 18 22:36:37 EST 2000 | Charles Harper

The major problems are poor layer to layer bond strength(due to surface tension of most fluoropolymers),and poor cold flow,or dimensional creep of these materials.Please also click on Chapter Author Konsowski,listed above.E-mail form will pop up when

Industry News: multilayer bonding (25)

Six IPC APEX EXPO Exhibiting Companies Earn 2020 Innovation Awards

Industry News | 2020-01-29 07:33:26.0

IPC announces the winners of the IPC APEX EXPO 2020 Innovation Awards, a celebration of the innovators who are changing the technological landscape of the electronics industry.

Association Connecting Electronics Industries (IPC)

PNC Inc. Acquires New Horizontal Oxide Line

Industry News | 2014-12-12 12:24:17.0

PNC Inc. has obtained a new Horizontal Conveyorized CO-BRA BOND In-line Oxide Replacement line from IPS (Integrated Process Systems). The machine is capable of coating 100 panels per hour to help expedite the inner layer treatment process. Compared to the previous process of manual dip tanks, the Oxide Replacement line is far more efficient due to automation. By using fewer heaters, the new unit is more energy efficient as well.

PNC Inc.

Technical Library: multilayer bonding (2)

Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures

Technical Library | 2010-06-03 22:23:03.0

Strategies for successful design and manufacture of microwave multilayer printed circuit boards. All aspects from pad registration, dimensional stability, impedance fluctuation, fusion bonding, thermal ageing, z-axis expansion, reliability, to Young's mod

Taconic

Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms

Technical Library | 2020-01-09 00:00:30.0

PCBs have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.

Polymer Competence Center Leoben GmbH

Videos: multilayer bonding (2)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

Indium's NanoBond® Process

Indium's NanoBond® Process

Videos

How the NanoBond® Process works

Indium Corporation

Events Calendar: multilayer bonding (1)

CALCE Reliability Science Symposium - Spring 2020

Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA

CALCE Reliability Science Symposium - Spring 2020

CALCE Center for Advanced Life Cycle Engineering

Career Center - Jobs: multilayer bonding (1)

Senior RF Circuits Design Engineer

Career Center | Brooklyn, New York USA | Engineering,Management

Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications.  With design, sales and manufacturing locations in over 30 countries, Mini-Ci

Mini-Circuits

Express Newsletter: multilayer bonding (158)

SMT Express, Issue No. 4 - from SMTnet.com

SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Front Page MULTILAYER BOARD (MLB) CONSTRUCTIONS FOR HIGHEST LAMINATE INTEGRITY, DIMENSIONAL STABILITY, AND ELECTRICAL

Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures

Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures This article discusses strategies for successful design

Partner Websites: multilayer bonding (12)

Adhesive Dispensing Equipment Manufacturers, Coating Equipment, Fluid Dispensing Systems | Nordson

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/

& Solutions Nordson produces industrial machinery designed to solve problems in an expansive set of diverse industries. View All Products Bonding

ASYMTEK Products | Nordson Electronics Solutions

IPC Standards for Manufacturing & Assembly - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post9030.html

specified IPC standards on here? Any and all thoughts are welcome! I will start this, Currently we only specify the following:- IPC-A-600 - Acceptability of Printed Boards IPC-4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards IPC-4103 - Specification for Base Materials for High Speed / High

PCB Libraries, Inc.


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