MVP’s enhanced Ultra SPI Solder Paste Inspection systems deploy our patented 3D technologies along with MVPs trusted AOI capabilities. Utilizing MVP’s patented technology, 3D Solder Paste Inspection (SPI) can be performed on paste for apertures as sm
The Ultra V is MVP’s fastest AOI system, designed for manufacturers with the need for the fastest beat rates. The Ultra V Series deploys the highest speed interfaces, computers and camera technologies to provide the fastest inspection times without
Board dimensions: 3 in. to 18 in. Configuration: * includes repair PC w/ repair s/w * s/w upgraded in 2013 - version 5.4 build 2013053 Camera: 3D Wide IVP / Pulnix 2048 x 2040 Software key: * PTH Post Solder * SMT Post Solder * Paste: Volum
Post Print, Post Placement and Solder Inspection. Qty.48 1.4 Megapixel Images per Second 0201 Capable includes repair station PC This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit f
Industry News | 2014-03-07 15:01:40.0
Bajabid.com will be conducting an online SMT Exchange Auction. This event will include a wide variety of electronic manufacturing & assembly equipment from several sellers sites located at different sites around the United States.
Industry News | 2014-03-19 15:09:03.0
BajaBid will be completing its latest online SMT Exchange Auction tomorrow [Thursday 3/20/14]. This event will include a wide variety of electronic manufacturing & assembly equipment from several sellers located at different sites around the United States.
Technical Library | 2016-05-19 16:03:37.0
As consumers become more reliant on their handheld electronic devices and take them into new environments, devices are increasingly exposed to situations that can cause failure. In response, the electronics industry is making these devices more resistant to environmental exposures. Printed circuit board assemblies, handheld devices and wearables can benefit from a protective conformal coating to minimize device failures by providing a barrier to environmental exposure and contamination. Traditional conformal coatings can be applied very thick and often require thermal or UV curing steps that add extra cost and processing time compared to alternative technologies. These coatings, due to their thickness, commonly require time and effort to mask connectors in order to permit electrical conductivity. Ultra-thin fluorochemical coatings, however, can provide excellent protection, are thin enough to not necessarily require component masking and do not necessarily require curing. In this work, ultra-thin fluoropolymer coatings were tested by internal and industry approved test methods, such as IEC (ingress protection), IPC (conformal coating qualification), and ASTM (flowers-of-sulfur exposure), to determine whether this level of protection and process ease was possible.
Technical Library | 2012-08-23 21:06:35.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Tetrabromobisphenol-A (TBBPA) is the predominant flame retardant used in rigid FR-4 printed wiring boards (PWB). In this application, the TBBPA is fully reacted into the epoxy res
Career Center | Lapu-lapu, Cebu Philippines | Engineering,Maintenance,Production
Sept. 2, 2009 to Present, TPM2, LEAR Corporation, MEPZ-1, Lapu-Lapu City • Provides SMT engineering support to day-to-day manufacturing operations. • Handles SMT pick-and-place machine (Fuji, CP7, CP6 and QP242 Series, Universal Genesis GI-14D). •
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. • UV curing equipment for semiconductor fabrication. Learn more about Nordson's full scope semiconductor fabrication solutions . Products Content FX-500 Ultra 3D SPI Nordson YESTECH's FX-500 ULTRA 3D SPI provides 3-D height, volume and area metrology for PCB boards with complex and small pad sizes where solder volume