Electronics Forum | Fri Apr 20 05:32:39 EDT 2001 | dougie
Hi, I've just splashed out �60 on IPC-A-600F trying to find out the formula for measuring the bow and twist of raw PCB's. Much to my dismay there are 10 lines on the subject in the whole standard. Worse still is that it tells me nothing I don't alre
Electronics Forum | Fri Sep 02 07:38:13 EDT 2005 | DannyJ
Hi Mike, I haven't tried the 0201s with a Hyrda, but after seeing 20 reviews of your message without a response, I'll try and share my experience with 0402s on a non-Hydra machine. The 0402s are slow, but I managed to get some speed by maxing out
Industry News | 2021-12-03 20:03:25.0
Differential pressure transmitter is a kind of pressure measuring instrument widely used in all kinds of chemical industry. Working principle of differential pressure transmitter is as follows. The differential pressure from the two-sided pressure pipes acts directly on the two-sided isolation diaphragm of the differential pressure transmitter sensor, and is transmitted to the measuring element through the sealing fluid in the diaphragm. The measuring element converts the measured differential pressure signal into the corresponding electrical signal and transmits it to the converter. After amplification and other processing, it becomes the standard electrical signal and then is output.
Industry News | 2019-03-31 20:43:34.0
Datest is celebrating its first year of partnership with VJ Technologies (VJT) on a West Coast inspection services center, showroom and demonstration facility. VJT is a global leader in providing digital X-ray inspection system and services solutions.
Technical Library | 2017-12-11 22:31:06.0
Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode setup. Localized extraction of residue was carried out using a commercial C3 extraction system. Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels.
Technical Library | 2019-09-11 23:33:04.0
There are numerous techniques to singulate printed circuit boards after assembly including break-out, routing, wheel cutting and now laser cutting. Lasers have several desirable advantages such as very narrow kerf widths as well as virtually no dust, no mechanical stress, visual pattern recognition and fast set-up changes. The very narrow kerf width resulting from laser ablation and the very tight tolerance of the cutting path placement allows for more usable space on the panel. However, the energy used in the laser cutting process can also create unwanted products on the cut walls as a result of the direct laser ablation. The question raised often is: What are these products, and how far can the creation of such products be mitigated through variation of the laser cutting process, laser parameters and material handling? This paper discusses the type and quantity of the products found on sidewalls of laser depaneled circuit boards and it quantifies the results through measurements of breakdown voltage, as well as electrical impedance. Further this paper discusses mitigation strategies to prevent or limit the amount of change in surface quality as a result of the laser cutting process. Depending on the final application of the circuit board it may prompt a need for proper specification of the expected results in terms of cut surface quality. This in turn will impact the placement of runs and components during layout. It will assist designers and engineers in defining these parameters sufficiently in order to have a predictable quality of the circuit boards after depaneling.
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
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