Electronics Forum: mydata r and c test board (Page 1 of 7)

Leaded and Lead Free BGA's on hte same board

Electronics Forum | Thu May 01 15:11:37 EDT 2008 | dphilbrick

CK So as I see it batch B represents a leaded process with leaded components and D is a leaded process with lead free components. Batch Components Paste B SnPb Sn62 D Lead-free Sn62 If so it is BETTER to run a lead free BGA with Sn

Wave flux and profiling

Electronics Forum | Wed Dec 20 04:43:36 EST 2006 | greg york

Any decent flux would volatise off with the heat of the wave unless absorbed into the solder mask. Test this by trying to clean in alcohol or common solvent aerosol, if it does not clean then it is probably Mineral Salts from solder mask fillers. Ano

Mydata Pick and place

Electronics Forum | Thu May 10 02:57:03 EDT 2001 | kjellman

Hi, Why not have a look at Philips/Assembl�on, their ACM machine is quite nice. It may also bring you down to Flip Chip, 0201 some through hole and odd form placement. Nice options like bulk feeding, coplanarity tests, fluxing for FC, prom feeders (

seperation of soldermask and pcb

Electronics Forum | Tue Mar 25 10:31:05 EDT 2014 | sara_pcb

The boards are baked for 2 hours at 120 deg C Regards, R.Saravanan

Re: IPC and Nepcon

Electronics Forum | Wed Nov 18 14:42:22 EST 1998 | Dave F

| I heard somewhere that SMEMA has joined IPC, and that the association has decided to boycott Nepcon from | year 2000. Can anyone tell me if this is true | Nick: SMEMA and IPC are talking about merging (EP&P, 11/98, p 18). Below is a news release

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:52:16 EDT 1998 | Gary Simbulan

| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Sun Apr 25 12:05:50 EDT 1999 | Chrys Shea

| | | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free solderin

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Mon Apr 26 09:18:27 EDT 1999 | C.K.

| | | | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free so

Placement Equipment and Long Boards

Electronics Forum | Mon Apr 09 10:16:14 EDT 2007 | davef

Pick and place: * Fuji: The largest pcb size is 20" by 18" for pick and place; 18"x14" for chip shooters. Fuji NP XL series allows 27 by 23 inch boards using a conveyor. * MYDATA has machines that can be configured to 34" X 44" X 0.500" * HSP 4796A a

ICT and specifying PCBA testing

Electronics Forum | Tue Mar 23 07:35:42 EDT 2010 | jooh

Since I'm new to the forum I probably ask previously answered questions (that I have not found) but I would be grateful if someone could clarify this for me. I'm in R&D at a company where we design low volume (1k-10k) fairly complex PCBAs for our pr

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