Automated & MSD compliant storage. The MYDATA SMD Tower provides more intelligent and automatic access to component reels and trays. The MYDATA SMD Tower boosts production efficiency with: Fast storage and retrieval of components. Auto
Where High Mix Meets High Speed. With the MY100e series pick-and-place machines, there’s no need to make the usual trade-offs between speed and flexibility. With the fastest changeovers in the industry and workcell solutions reaching speeds of up t
Industry News | 2010-07-08 13:47:20.0
MYDATA has released the MYLabel PRM (Proactive Replenishment Monitor) option, which is a software tool that will improve uptime and ensure correct material delivery to the SMT assembly line. When combined with the automatic storage solution SMD Tower, the replenishment process becomes completely automated. Component reels will be delivered to the operators by a robotic arm, and the risk of providing incorrect material to the line is reduced to practically zero.
Industry News | 2013-02-06 13:10:47.0
MYDATA recently announced the release of MYCenter 2.1, a next-generation software solution that helps to improve control and efficiency in SMT production. Further strengthening what is already one of the most comprehensive software suites in the industry, the solution offers SMT manufacturers a robust platform with three modules that can be integrated into all types of production environments.
To provide customers with new JUKI mounting machine and SMT mounting equipment, supply new JUKI mounting machine, Samsung mounting machine, Panasonic mounting machine, FUJI mounting machine, YAMAHA mounting machine, Siemens mounting machine, MYDATA m
Technical Library | 2009-04-23 08:14:37.0
No SMT equipment can place accurately and run efficiently without quality nozzles and feeders. These two factors are the core of the pick and place process. If the machine is either unable to pick parts consistently or hold on to the components during the transport from feeder to PCB, defects will result.
Technical Library | 2012-02-02 19:09:53.0
A miniaturized wafer-level packaged MEMS acceleration switch with through silicon vias (TSVs) was fabricated, based on technologies suitable for harsh environment applications. The high aspect ratio TSVs were fabricated through the silicon-on-insulator (S
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