Electronics Forum | Tue Jan 04 15:28:22 EST 2005 | davef
Look here: * Circuit Board Repair and Rework Guide [ http://www.circuittechctr.com/guides/guides.shtml ] * 7711/21A - Rework and Repair Guide [ http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=TOCFRAME&ARGUMENTS=-N,-N,-A,-A,-N50 ]
Electronics Forum | Wed Oct 15 08:16:56 EDT 2003 | MA/NY DDave
Hi http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=TOCFRAME&ARGUMENTS=-N,-N,-A,-A,-N50 And then look at 4202 and some of the others. YiEngr, MA/NY DDave
Electronics Forum | Thu Nov 10 20:14:44 EST 2005 | davef
FREE DOWNLOAD - SMEMA3.1 - Fiducial Mark Standard http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=TOCFRAME&ARGUMENTS=-N,-N,-A,-A,-N50
Electronics Forum | Thu Mar 03 16:33:24 EST 2005 | pjc
Revision D has over 730 new and updated illustrations of acceptability criteria and has been critically reviewed for clarity and accuracy. The document synchronizes to the requirements expressed in other industry consensus documents and is used with
Electronics Forum | Fri Jun 01 08:29:41 EDT 2007 | patrickbruneel
OR: Stands for organic (organic acid based flux) with the absence of rosin and/or resin. If you want to know everything about the classification of fluxes get the J-STD-004 �Requirements for Soldering Fluxes� at following link: http://webvision.ipc
Electronics Forum | Thu Dec 07 19:54:55 EST 2006 | davef
We agree with "guest" above. This a "chip bonder" type material used to improve the reliability of array type devices. "A relative comparison of the N50 values is given below: No underfill = 1.0X (baseline) Corner bond = 1.3X Non reworkable underfi
Electronics Forum | Mon Jul 16 21:44:07 EDT 2001 | davef
You�re correct. If you attach $5 to each board, your customer will be happy to approve your process change. Consider: �Process Improvement Strategies: Implementation Of A No-Clean Process" http://www.smta.org/knowledge/proceedings_abstract.cfm?PRO
Electronics Forum | Wed Mar 02 06:19:03 EST 2005 | pjc
Go to http://www.ipc.org and look up IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components
Electronics Forum | Tue Aug 19 09:23:18 EDT 2003 | caldon
FUJI DUDE- You can purchase a Kit from IPC for verifying machine acceptability. IPC-9850 full kit with Components and boards, and such will set you back around $26,250 (member price). Just the glass board alone will cost you $3,800 (member Price).Thi
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