Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
Industry Directory | Distributor / Manufacturer
eTECH Supply is a distribution company focused on the needs of Printed Circuit Board Assembly & Repair industry.
New Equipment | Cleaning Equipment
Fully Automatic SMT Stencil Cleaning System BMP-700S Feature ▶The cleaning tank, the original tank, and the spray tank are designed with liquid level sensor overflow alarm. ▶The opening of the front door is designed with photoelectric sensor protect
New Equipment | Cleaning Equipment
Fully Automatic SMT Stencil Cleaning System BMP-700S Feature ▶The cleaning tank, the original tank, and the spray tank are designed with liquid level sensor overflow alarm. ▶The opening of the front door is designed with photoelectric sensor protect
Electronics Forum | Tue Apr 13 13:22:15 EDT 2004 | babe
Try another solder paste manufacturer. Aim out of Rhode Island, Alpha and or Kester. I'm sure that they will be of better assistance than the current supplier. Good Luck
Electronics Forum | Tue Apr 13 13:55:46 EDT 2004 | arcandspark
I have samples coming in, AIM and ALPHA, Multicore use to have manufacturing in the same town but disappeared. Your right about getting better help fro other, Indium is the worse I have ever had to deal with. They act like I am bothering them when I
Industry News | 2011-11-03 21:52:00.0
By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.
Industry News | 2023-11-27 12:45:07.0
The Surface Mount Technology Association (SMTA) announces the release of several more webinars, photo libraries, and poster sets as part of a generous donation from renowned industry expert, Bob Willis.
Technical Library | 2022-06-20 21:01:37.0
We've been doing a lot of print testing in our lab. In our first set of published results, "The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance1" from IPC/APEX 2016, we revealed a hierarchy of input variables to maximize solder paste transfer efficiency and minimize variation. In that study, we used a fully-optioned stencil as part of the equipment set. In order to tease out the data we were looking for, we could not lose critical information to the noise of stencil-induced variations.
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
New features highlight the ability for the customer to control what Process features are available.
Demonstrates desoldering, solder paste printing, and installation of a fine pitch QFP 208 (30.6mm x 30.6mm) component using an ATCO model AT-GDP Placement & Rework Station.
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Events Calendar | Thu Oct 28 00:00:00 EDT 2021 - Thu Oct 28 00:00:00 EDT 2021 | ,
Juarez Chapter Webinar: Pin in Paste
Career Center | Rocklin, California USA | Production
General Overview of Position With this new position Parallax aims to improve our USA manufacturing throughput in a time when most companies normally only send work offshore. This raises the standard for requiring efficient use of our Pick and Place
Career Center | hyd, andhra pradesh India | Engineering,Production,Research and Development,Technical Support
i have a experience in smt and i acan operate europlacer and mydata machines.
Career Center | chennai, Tamil nadu India | Engineering,Production
KEY SKILLS; 1.PRINTING, PICK AND PLACE MACHINE OPERATION, 2.REFLOW OVEN CHARACTERISTICS, 3.IPC STANDARD,QUALITY POLICIES 4.AOI PROGRAMMING 5.c,c++LANGUAGES. 6.VerilogHDL. 7.ORCAD,PSPICE software known.
Lewis & Clark | https://www.lewis-clark.com/product-tag/aim/
AIM Archives - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal: $ 0.00 View Cart Checkout Lewis and Clark, Inc
| https://www.feedersupplier.com/sale-21039854-jig-chip-mounter-smt-machine-nozzle-fuji-aim-nxt-aa06a00.html
; 2,Solder Paste Printers of Yamaha,Dek,GKG,our own brand, etc. 3,AOIs of Saki,our own brand,etc. 4,Reflow ovens of ETC,Heller,some Chinese brand,etc
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