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Industry Directory | Manufacturer's Representative
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
ASCEN Auto PCB solder paste printer SE700 model is a very accurate fully automatic SMT stencil printer. It includes a powerful AT-align automatic fiducial finding and PCB board offset adjustment system. After pressing the start key, the PCB
PCB solder paste printer for SMT is needed to screen print solder paste onto the printed circuit board (PCB) before placement of surface mount components (SMD) for Reflow Soldering. Automatic PCB solder paste screen printer with pecial
Electronics Forum | Tue Nov 29 21:51:37 EST 2005 | wmeyers
I have a pin and sleeve assembly that utilizes a fusible link type of solder, Bi, Cd, Pb and Sn alloy. The pin is gold plated, the sleeve is copper alloy 725. I have had sporadic success with wetting of the sleeve during the reflow process. To improv
Electronics Forum | Mon Apr 28 09:59:04 EDT 2003 | davef
Your customer's question is reasonable. Soldering to nickel is not always a walk on the beach [can of corn, or whatever]. This issue is flux not solder. Your Sn63 will have plenty of strength, providing the solder connection is well formed. You s
Industry News | 2011-06-09 13:06:41.0
Focused on critical, practical and social issues facing the electronics manufacturing industry, these sessions are based on award-winning technical papers from IPC APEX EXPO 2011. The one-hour webinars offer organizations cost-effective opportunities to bring important new information directly to their conference rooms.
Industry News | 2011-09-06 15:20:36.0
SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen.
Parts & Supplies | SMT Equipment
PA Main Parts Part Name：NICKEL HYDRIC STORAGE BATTERY PART No：N9973GB6-005 Part Name：PIN PART No：1023810003 Part Name：VANE PART No：N45214022A Part Name：CAM FOLLOWER & LOCK-NUT PART No：N531CFH6RA Part Name：PIN PART No：102381000
Parts & Supplies | SMT Equipment
PA Main Parts Part Name：NICKEL HYDRIC STORAGE BATTERY (电池) PART No：N9973GB6-005 Part Name：PIN (MSH头部螺丝-长) PART No：1023810003 Part Name：VANE (真空泵碳片) PART No：N45214022A Part Name：CAM FOLLOWER & LOCK-NUT (支撑凸轮及螺母) PART No：N531CFH6RA Part Nam
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
Technical Library | 2020-11-24 23:12:27.0
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-paste technology also increase solder paste use. More components and more solder paste result in more outgassing of chemistry during the reflow process. Some assemblies report condensation of vapors when the cold printed circuit board enters the oven. Little is known about the interaction between these condensed materials in terms of the interaction between these condensed materials and the reliability of the assembly. Apart from the question of reliability, a printed circuit board contaminated with a small film of residues after reflow soldering is not desirable.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
Article Return to Front Page No-Residue Technolo
| https://pcbasupplies.com/wp-content/uploads/2023/10/S3X58-M650-7-solder-paste.pdf
S3X58-M650-7 Halogen free pin testable solder paste Flux residue of conventional solder paste tends to deposit over the solder joint, and could lead to errone- ous readings in ICT evaluation even when
| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf
