Electronics Forum | Mon Dec 06 03:54:57 EST 1999 | Chris May
Hi Russ, I have a similar situation. I have been told that this can be caused by the nickel, over which the gold is plated, can result in suspect joints, embrittlement etc. Some joints can even be weak and broken without much force on some of my boa
Electronics Forum | Mon May 17 13:21:45 EDT 2021 | SMTA-64387881
PWB Bake out or other elevated temperture processes can cause issues with oxidation of that Nickel layer. The gold porosity can vary from batch to batch, but also process changes can contribute. Are you baking the boards or have previous reflow pro
Industry News | 2012-02-28 21:08:53.0
ZESTRON will feature several new products as well as equipment at the IPC APEX 2012 Booth #3621. These include HYDRON® WS 325, VIGON® N 600 and Pressure Product’s latest Concentration Monitoring Systems.
Industry News | 2012-05-15 10:24:23.0
ZESTRON will exhibit at the SMTA Tampa Bay in Largo, Florida on May 15th and at the SMTA Toronto Expo on May 16th in conjunction with the International Conference on Soldering and Reliability (ICSR) in Toronto, Ontario, Canada. Furthermore, ZESTRON is pleased to announce that Umut Tosun, Application Technology Manager, will present “Maintaining OSP Coating Integrity During the Cleaning Process” at the ICSR.
Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder As technology becomes increasingly reliant
. This is not an easy feat to achieve. Corrosion is defined as the deterioration of a material or its properties due to a reaction of that material with its chemical environment. [1
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