Electronics Forum | Wed May 16 15:22:25 EDT 2007 | mainenetservices
Below is a call-in question: Has there been a Benchmark study done for Best-In-Class Cost Per Placement of components on PCBA? Also, is there an industry standard to calculate cost per placement of components on PCBA? Any help would be greatly app
Electronics Forum | Tue Mar 29 13:58:52 EDT 2016 | nicole0506
Hello! My name is Nicole and I'm new here :-) I hope you could help me...we recently bought an Ekra X5, and I was informed that it could dispense paste on the stencil on her own, using a cartridge that is placed near the squeegees. Can anyone tell me
Industry News | 2001-01-23 10:52:31.0
IPC has honored 27 members at IPC SMEMA Council's Electronic Assembly Process Exhibition and Conference (APEXSM) in San Diego, CA for their contributions to IPC and the electronics industry.
Industry News | 2012-03-07 21:08:08.0
The electronic interconnect industry came together at IPC APEX EXPO® last week in San Diego, with the show reporting a 26 percent increase in attendance over 2011 with 4,915 conference and exhibit hall attendees. IPC reported that 407 exhibitors participated in the event, resulting in 8,963 total visitors.
Technical Library | 2014-11-13 19:23:50.0
With increasing power loss of electrical components, thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advances in semiconductor technology, particularly in the regime of high-power components, the temperature dependence of the long-term reliability is a critical parameter and has to be considered with highest possible care during the design phase (...) The aim of this paper is to give a short overview about standard thermal solutions like thick copper, thermal vias, plugged vias or metal core based PCBs. Furthermore, attention will be turned on the development of copper filled thermal vias in thin board constructions...
Nicolics, Michael Unger - Vienna University of T
| https://productronica.com/de/rechtliche-informationen/impressum/
Oberbürgermeister Dieter Reiter Inhaltlich verantwortlich Nicole Hagenbring, Messe München GmbH, Am Messesee 2, 81829 München, Deutschland Registereintragung Registergericht
Surface Mount Technology Association (SMTA) | https://www.smta.org/certification/certified_engineers.cfm
Dan Ostrander, Western Digital Corporation Jeff Owens, Ducommun, Inc. Dennis Padilla, Empire Electronics Gabriel Padilla, Ford Motor Company Kyler Page, Ducommun Vince Parente, Lenze Kay Parker, Indium Corporation Simona Partinova, Pennatronics Nicole
