Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
No Correlation between Solder Joint Void and Thermal Cycle Integrity, J. Smetana et al [10] The Smetana investigation documented that for both a ceramic BGA component and a plastic CSP component, the void diameter or area percentage had no correlation
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