Electronics Forum | Sat Aug 02 08:06:11 EDT 2008 | pcbbuilders
Is there a limit to the time that most components can stay at temperatures around 130-200 deg c? if i slow the time, the first 4 zones will be at this temp for about 5 minutes in no lead process. i am concerned that some chips wont be rated at this t
Electronics Forum | Mon Aug 04 09:30:16 EDT 2008 | grics
If you have concerns, you can look at the datasheet for each component or contact one of their application or materials engineers and find out what the components are rated for...process-wise. IE, how long can I be in the oven with this part, at what
Industry News | 2003-03-12 09:10:10.0
As part of the opening celebration, Teradyne will be exhibiting this week at SEMICON China and in April at Nepcon Shanghai.
Industry News | 2015-05-07 19:28:29.0
MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.
Technical Library | 2014-12-11 18:00:09.0
The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Wire bonded packages using conventional copper lead frame have been used in industry for quite some time. However, the demand for consumer electronics is driving the need for flip chip interconnects as these packages shorten the signals, reduce inductance and improve functionality as compared to the wire bonded packages. The flip chip packages have solder bumps as interconnects instead of wire bonds and typically use an interposer or organic substrate instead of a metal lead frame (...) The paper provides a general overview of typical defects and failure modes seen in package assembly and reviews the efforts needed to understand new failure modes during package assembly. The root cause evaluations and lessons learned as the factory transitioned to thin form factor packages are shared
Technical Library | 2019-05-06 23:04:05.0
The temperature and humidity test chamber simulate the temperature and humidity, so there are a lot of things customers shoud notice in the process of use, although there is detailed instruction when purchasing the equipment. But some users just know how the device works and start using it. This is very easy to cause problems in the use of the equipment, so Symor intends to describe the safety details during the use of temperature and humidity chamber. 1. Before the test, determine if the sample contains flammable and explosive substances to avoid combustion or explosion during the test. Of course, also make sure there is no flammable and explosive material around the test equipment, otherwise it may cause fire and other accidents. 2, Do not open the chamber door to operate during the experiment, or the gas in the studio may cause the operator to burn and so on. 3. At the end of the test or at the time of regular cleaning of the test chamber, power off the equipment to avoid electrocution accidents. Also, when cutting off the equipment power, pull the power cord to pull out the plug, otherwise it may lead to a rupture of the power cord and so on. You can contact manufacturers if there are some places you donnot understand, do not dismantle and repair the temperature and humidity test chamber without authorization, otherwise it may lead to more serious problems.
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SMTnet Express, November 6, 2014, Subscribers: 23500, Members: Companies: 14091, Users: 37109 Effect of Process Variations on Solder Joint Reliability for Nickel-based Surface Finishes Hugh Roberts, Sven Lamprecht, Gustavo Ramos, Christian Sebald
Assembly Process Variables Voiding At A Thermal Interface News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Effects of Assembly Process Variables On Voiding At A Thermal
| https://www.eptac.com/industry-growth-means-more-soldering-jobs-in-electrical-and-electronics-manufacturing/
2nd November, 2021 by EPTAC Staff Recent Articles IoT and the Aerospace Industry – Too Risky? Leaded vs. Lead-Free Solder: Which is Better? The 5 Essential Tools for Soldering The Importance of IPC-A-610 Certification How to Build on Your Career in Soldering Categories Blog Uncategorized Why Get IPC Certified The next time you are out
Blackfox Training Institute, LLC | https://www.blackfox.com/news-events/should-you-use-lead-or-lead-free-solder/
. When you look at a spool of leaded solder, the numbers next to Sn and Pb, like Sn63/Pb37, indicate how much tin and lead is in that solder
