New SMT Equipment: nipdau (1)

Systems for Plasma Prior to Conformal Coating

Systems for Plasma Prior to Conformal Coating

New Equipment | Coating Equipment

Plasma treatment prior to conformal coating addresses these detrimental manufacturing issues: Removes organic contaminants Eliminates flux and mold release residue Enhances surface wettability Enhances lead coverage Improves adhesion Systems

Nordson MARCH

Electronics Forum: nipdau (15)

Solderability Problem on NiPdAu

Electronics Forum | Sun Sep 12 12:45:56 EDT 2010 | tony1

Hi there, does anyone experience in NiPdAu solderability dip & look test? I experiencing solder non wet issue on side I/O & also center ground for QFN package. Appreciate someone can offer me a solution. Thanks

NiPdAu Soldering Problems?

Electronics Forum | Thu Sep 18 23:56:56 EDT 2008 | trynders

am having wetting issues with two Burr Brown Op amps. Both are SOICs with NiPdAu lead frame finishes. I have attached a photo that shows a black streak the length of the lead (before soldering). This appearance is consistent of all leads and is exist

Industry News: nipdau (8)

SMTA International Technical Committee Announces Best Presentation & Paper Awards from the 2019 Conference

Industry News | 2020-03-19 13:12:42.0

The SMTA is pleased to announce the Best Papers from SMTA International 2019. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.

Surface Mount Technology Association (SMTA)

Nordson MARCH Research Evaluates the Effects of RF Plasma Processing Prior to Conformal Coating on Adhesion, Conformity of Coverage, and Electrical Functionality

Industry News | 2016-03-03 08:27:28.0

Nordson MARCH has recently released a white paper showing the results of RF plasma processing on conformal coating adhesion, the conformity of the coating coverage, and the resulting effects on electrical functionality of a fully assembled printed circuit board. The research was done in conjunction with Nordson ASYMTEK, AirBorn Electronics, and SMART Microsystems (formerly known as Desich SMART Center). The paper can be downloaded at http://bit.ly/MARCH-PlasmaWP.

Nordson MARCH

Technical Library: nipdau (5)

Evaluating the Effects of Plasma Treatment prior to Conformal Coating on Electronic Assemblies to Enhance Conformity of Coverage

Technical Library | 2017-06-01 17:12:08.0

The corrosion of Nickel-Palladium-Gold (Ni-Pd-Au) finish terminals in humid environments is known to be reduced with the application of a conformal coating such as acrylic. Corrosion has a higher rate of occurrence around the terminal ‘knee’ of a surface mount component, which may be reduced with the application of conformal coatings. Although radio frequency (RF) plasma processing is generally known to enhance conformity of conformal coating to surfaces through ionic bombardment, the effect on the functionality of assembled printed circuit boards (PCB) is not as well known. The purpose of this study is to assess whether RF plasma processing can enhance the adhesive and coverage qualities of an acrylic conformal coating on PCBs, specifically on Ni-Pd-Au terminals with a knee, and if plasma processing has an effect on the electrical functionality of components and fully assembled PCB.

Nordson MARCH

Failure Modes in Wire bonded and Flip Chip Packages

Technical Library | 2014-12-11 18:00:09.0

The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Wire bonded packages using conventional copper lead frame have been used in industry for quite some time. However, the demand for consumer electronics is driving the need for flip chip interconnects as these packages shorten the signals, reduce inductance and improve functionality as compared to the wire bonded packages. The flip chip packages have solder bumps as interconnects instead of wire bonds and typically use an interposer or organic substrate instead of a metal lead frame (...) The paper provides a general overview of typical defects and failure modes seen in package assembly and reviews the efforts needed to understand new failure modes during package assembly. The root cause evaluations and lessons learned as the factory transitioned to thin form factor packages are shared

Peregrine Semiconductor

Express Newsletter: nipdau (3)


nipdau searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t net
  1 2 3 4 Next


High Throughput Reflow Oven
Reflow Oven

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
used smt parts china

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
Free PCB Design Checker

Inspection mirrors for electronic rework and repair.
Digital Inspection Equipment

Best Reflow Oven
PCB separator

MSD storage in desiccant dry canbinets