Industry News: nipdau (Page 1 of 1)

SMTA International Technical Committee Announces Best Presentation & Paper Awards from the 2019 Conference

Industry News | 2020-03-19 13:12:42.0

The SMTA is pleased to announce the Best Papers from SMTA International 2019. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.

Surface Mount Technology Association (SMTA)

Nordson MARCH Research Evaluates the Effects of RF Plasma Processing Prior to Conformal Coating on Adhesion, Conformity of Coverage, and Electrical Functionality

Industry News | 2016-03-03 08:27:28.0

Nordson MARCH has recently released a white paper showing the results of RF plasma processing on conformal coating adhesion, the conformity of the coating coverage, and the resulting effects on electrical functionality of a fully assembled printed circuit board. The research was done in conjunction with Nordson ASYMTEK, AirBorn Electronics, and SMART Microsystems (formerly known as Desich SMART Center). The paper can be downloaded at

Nordson MARCH

FCT Assembly Develops Anti-tombstoning Paste Formulation

Industry News | 2014-02-03 14:13:04.0

FCT Assembly is pleased to announce that it now offers a variety of anti-tombstoning solder pastes as an option with each of its solder paste fluxes.


FCT Assembly Introduces NL930PT Pin Probable Solder Paste

Industry News | 2010-03-22 13:14:36.0

GREELEY, CO — FCT Assembly introduces its NL930PT no-clean, lead-free, halide-free pin probable solder paste. The product is unique in that it is a clear residue paste that can print down to low surface area ratios consistently. Combined with SN100C, this solder paste produces the most cosmetically appealing solder joint available on the market.


FCT Assembly Introduces NL932 No-Clean Paste

Industry News | 2010-03-22 13:59:02.0

GREELEY, CO — FCT Assembly introduces its NL932 no-clean, lead-free, halide-free solder paste. The paste features excellent solderability, enabling the process to handle the most difficult wetting requirements.


FCT Assembly's NL930PT Pin Probable Paste Wins a 2011 NPI Award

Industry News | 2011-04-20 20:31:30.0

FCT Assembly is pleased to announce that it has been awarded a 2011 NPI Award in the category of Soldering Materials for its NL930PT Pin Probable Solder Paste.


Henkel Launches High-Lead and Lead-Free Capable Die Attach Solder Paste for Enhanced Thermal Control of Power Devices

Industry News | 2009-07-24 13:38:04.0

To address the thermal requirements posed by smaller outline, higher functioning power semiconductor devices, Henkel has formulated an advanced die attach solder paste suitable for both high-lead and lead-free applications.

Henkel Electronic Materials

Henkel Extends Die Attach Solder Paste Product Line, Adds Printable Formula to Popular Portfolio

Industry News | 2009-11-19 14:48:22.0

Broadening its well-known Multicore die attach solder portfolio, which already includes Multicore DA100 solder paste for high-lead and lead-free applications, Henkel today announced the launch of Multicore DA101. This newest formulation delivers many of the well-known benefits of Multicore DA100, but has been designed for screen print operations, thus offering flexibility for varying process requirements.

Henkel Electronic Materials


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