New SMT Equipment: nipdau issue (1)

Systems for Plasma Prior to Conformal Coating

Systems for Plasma Prior to Conformal Coating

New Equipment | Coating Equipment

Plasma treatment prior to conformal coating addresses these detrimental manufacturing issues: Removes organic contaminants Eliminates flux and mold release residue Enhances surface wettability Enhances lead coverage Improves adhesion Systems

MARCH Products | Nordson Electronics Solutions

Electronics Forum: nipdau issue (6)

NiPdAu solderability Issue

Electronics Forum | Mon Sep 20 11:21:48 EDT 2010 | tony1

I have this NiPdAu small QFN packge sizes less than 2x2. I tried to do solderability Dip And Look test and there's always some units no wet on either ground pad and small I/O. Can someone help to explain why is this so difficult to set on this surfac

Solderability Problem on NiPdAu

Electronics Forum | Sun Sep 12 12:45:56 EDT 2010 | tony1

Hi there, does anyone experience in NiPdAu solderability dip & look test? I experiencing solder non wet issue on side I/O & also center ground for QFN package. Appreciate someone can offer me a solution. Thanks

Industry News: nipdau issue (2)

FCT Assembly's NL930PT Pin Probable Paste Wins a 2011 NPI Award

Industry News | 2011-04-20 20:31:30.0

FCT Assembly is pleased to announce that it has been awarded a 2011 NPI Award in the category of Soldering Materials for its NL930PT Pin Probable Solder Paste.

FCT ASSEMBLY, INC.

Henkel Extends Die Attach Solder Paste Product Line, Adds Printable Formula to Popular Portfolio

Industry News | 2009-11-19 14:48:22.0

Broadening its well-known Multicore die attach solder portfolio, which already includes Multicore DA100 solder paste for high-lead and lead-free applications, Henkel today announced the launch of Multicore DA101. This newest formulation delivers many of the well-known benefits of Multicore DA100, but has been designed for screen print operations, thus offering flexibility for varying process requirements.

Henkel Electronic Materials

Express Newsletter: nipdau issue (622)


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