Electronics Forum: nipdau leadframe (1)

QFN Solderability

Electronics Forum | Tue Apr 26 03:28:26 EDT 2005 | Just mee

What test is applicable to check for QFN package with NiPdAu leadframe if leads/pad are solderable? what are the options other than dip and look solderability testing? Thanks,

Industry News: nipdau leadframe (2)

Henkel Launches High-Lead and Lead-Free Capable Die Attach Solder Paste for Enhanced Thermal Control of Power Devices

Industry News | 2009-07-24 13:38:04.0

To address the thermal requirements posed by smaller outline, higher functioning power semiconductor devices, Henkel has formulated an advanced die attach solder paste suitable for both high-lead and lead-free applications.

Henkel Electronic Materials

Henkel Extends Die Attach Solder Paste Product Line, Adds Printable Formula to Popular Portfolio

Industry News | 2009-11-19 14:48:22.0

Broadening its well-known Multicore die attach solder portfolio, which already includes Multicore DA100 solder paste for high-lead and lead-free applications, Henkel today announced the launch of Multicore DA101. This newest formulation delivers many of the well-known benefits of Multicore DA100, but has been designed for screen print operations, thus offering flexibility for varying process requirements.

Henkel Electronic Materials

Express Newsletter: nipdau leadframe (13)


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