Industry News: no and solder and fillet (Page 1 of 1)

EIT, LLC Partners with MIRTEC for Outstanding Performance and 3D Defect Detection Capability

Industry News | 2016-12-05 19:15:04.0

MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce that EIT, LLC, a High-Tech Electronic Manufacturing Services (EMS) company specializing in high-quality manufacturing and box-build assemblies, has selected MIRTEC’s MV-6 OMNI 3D AOI Machine based on outstanding performance and 3D defect detection capability.

MIRTEC Corp

MIRTEC to Preview the MP-520 Advanced System in Package (SiP) Inspection and Measurement System at SEMICON West 2015

Industry News | 2015-06-11 16:02:18.0

MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.

MIRTEC Corp

OBMFG Selects MIRTEC 3D AOI Above All Others for Inspection Performance and Ease of Programming

Industry News | 2020-06-18 14:14:42.0

MIRTEC is pleased to announce that Out of the Box Manufacturing has purchased an MV-6 OMNI to meet their ongoing commitment to continuous process improvement. The Award-Winning MV-6 OMNI is the perfect 3D Inspection Solution to enable OBMFG to provide their customers with flawless manufacturing quality and consistent on-time deliveries all at a competitive price!

MIRTEC Corp

Compact Reference Manuals to IPC-A-610E and IPC J-STD-001 Illustrate Acceptance Criteria in a Handy Format for Inspectors and Operators

Industry News | 2010-09-30 00:35:51.0

The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.

Association Connecting Electronics Industries (IPC)

New Tutorial Released With IPC-2223C Provides Expert Advice and Tips for Designers Working With Flexible Circuits

Industry News | 2012-03-28 08:47:23.0

he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.

Association Connecting Electronics Industries (IPC)

Pin-in-Paste Reflow Calculations and Special Cases

Industry News | 2018-10-18 08:43:30.0

Pin-in-Paste Reflow Calculations and Special Cases

Flason Electronic Co.,limited

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

ASC to Demonstrate SPI and AOI Solutions at the IPC APEX EXPO

Industry News | 2013-02-14 13:04:45.0

ASC International announces that it will demonstrate its VisionPro AP500, AV862 AOI and SAKI AOI systems in in Booth #2801 at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California.

ASC International

Saki Demonstrates 3D SPI, AOI, AXI, and 2D Bottom-side AOI at IPC APEX Expo Booth 1407

Industry News | 2019-01-22 12:41:53.0

Saki Corporation will present its 3D solder paste inspection (SPI), automated optical inspection (AOI), and automated x-ray inspection (AXI) systems, plus new 2D Bottom-side AOI, at IPC APEX Expo 2019, January 29-31, at the San Diego Convention Center, San Diego, CA, at booth #1407. In addition, Saki's M2M communication/Industry 4.0/Smart Factory capabilities will be on display in the Fuji booth #1317 and in the Hermes/CFX production line.

SAKI America

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