Industry Directory: no clean solder wash white residue (2)

Florachem Corp

Industry Directory | Service Provider

Florachem provides cleaning agents including products for defluxing,stencil/misprint cleaning and removal of white residue. We also supply rosin derivatives for manufacture of solder fluxes and pastes

SIPAD Systems Inc.

Industry Directory | Manufacturer of Bare PCBs / Assembly / Screen Printing / Soldering

The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.

New SMT Equipment: no clean solder wash white residue (96)

Water-Soluble Fluxes For Leaded Chemistries

New Equipment | Solder Materials

Organic fluxes are commonly called "water soluble fluxes." Organic fluxes generally provide greater fluxing ability than rosin, but the ionizable nature of the water-soluble residue makes organic fluxes too conductive and potentially corros

Qualitek International, Inc.

VIGON® A 250 - Water Based PCB Defluxing Agent

VIGON® A 250 - Water Based PCB Defluxing Agent

New Equipment | Cleaning Agents

PCB Cleaning Medium with a Mild Formulation Especially for Sensitive Metal Alloys VIGON A 250 is a water-based MPC® cleaning agent designed to remove flux residues and solder pastes from electronic assemblies. Due to its mild formulation, VIGON® A 2

ZESTRON Americas

Electronics Forum: no clean solder wash white residue (308)

white residue after wash

Electronics Forum | Fri Apr 03 02:52:42 EST 1998 | Jacqueline Coia

At this moment in time we are using water soluble solder paste on our PCBs these are cleaned using water only, agitated with ultrasonics. After drying a white/grey residue is left around solder joints. Reflow profile is fine and a reliable wash proce

Re: white residue after wash

Electronics Forum | Sun Apr 05 18:59:15 EDT 1998 | Graham Naisbitt

Jaqueline There are so many variables in the electronic assembly manufacturing process involving more than 12 different chemistries, that it is impossible to easily identify and determine the nature and reason of such residues. GEC Hirst Research in

Industry News: no clean solder wash white residue (72)

ZESTRON’s Terry Price will be Presenting at SMTA International 2019

Industry News | 2019-09-11 14:35:41.0

ZESTRON is pleased to announce that Terry Price, PhD will be presenting, “pH Neutral Cleaning Agents: Technology and Performance” with Axel Vargas of Lockheed Martin at SMTA International on September 24th

ZESTRON Americas

Ravi Parthasarthy to Present at the November SMTA Capital Chapter Meeting

Industry News | 2017-10-25 19:54:52.0

ZESTRON is pleased to announce it will host the November SMTA Capital Chapter Meeting. Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer, ZESTRON Americas, will present “Cleaning Before Conformal Coating” and “pH Neutral Cleaning Agents – Market Expectation & Field Performance.” Cleaning Before Conformal Coating - Do you conformally coat your electronic assemblies? If so, cleaning prior to conformal coating is a must to ensure the long-term reliability of your products. This presentation provides an overview of potential failure mechanisms resulting from coating over residues.

ZESTRON Americas

Parts & Supplies: no clean solder wash white residue (4)

DEK BOOM  BOARD CLAMPS 500MM

DEK BOOM BOARD CLAMPS 500MM

Parts & Supplies | Pick and Place/Feeders

101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146

Qinyi Electronics Co.,Ltd

DEK BOOM 500MM BOARD CLAMPS

DEK BOOM 500MM BOARD CLAMPS

Parts & Supplies | Pick and Place/Feeders

101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146

Qinyi Electronics Co.,Ltd

Technical Library: no clean solder wash white residue (4)

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

ph Neutral Cleaning Agents - Market Expectation & Field Performance

Technical Library | 2016-02-25 16:26:25.0

With regard to precision cleaning applications within electronics manufacturing, pH neutral product development was a major breakthrough in recent years. The impetus for this development resulted from changes with regard to solder paste formulations and resulting assembly processes.The greater use of lead-free solder paste and the required higher reflow profiles have resulted in even more difficult to remove burnt-in flux residues. Coupled with increases in component density, larger component packages, higher lead counts, finer lead spacing, and lower standoff distances, effective cleaning is greatly challenged. The aqueous alkaline based cleaning agents can effectively remove these flux residues, however, the process often requires an increase in wash temperature and exposure time, chemical concentration, and mechanical energy. Although an efficient and effective cleaning process can be developed, oftentimes, the required operating parameters present a new set of challenges with regard to material compatibility.Since their introduction, the newly developed pH neutral formulations have proven to be capable not only of removing these difficult post reflow residues from complex board geometries, but do so without affecting material compatibility of sensitive components. Additionally, they perform at low concentration levels. This study reviews the performance of pH neutral cleaning agents as compared to alkaline cleaning agent alternatives and includes field data demonstrating their effectiveness with regard to material compatibility and cleaning performance.

ZESTRON Americas

Videos: no clean solder wash white residue (6)

ZESTRON FAST® (Fast Acting Surfactant Technology) Technology

ZESTRON FAST® (Fast Acting Surfactant Technology) Technology

Videos

"Fast Acting Surfactant Technology" (FAST®) is an innovative surfactant-based cleaning technology developed by ZESTRON. FAST® Technology based cleaning agents are a proprietary mix of newly developed surfactants, which allows for a quicker removal of

ZESTRON Americas

ErgoSonic - Automatic / Closed loop Stencil & Pallet Cleaner

ErgoSonic - Automatic / Closed loop Stencil & Pallet Cleaner

Videos

The first ergonomicly designed front-loading ultrasonic stencil cleaner The ErgoSonic Model Stencil & Pallet Cleaner is fully automatic and programmable. The operator loads the stencil into an empty chamber and selects the desired cleaning profile.

Smart Sonic Stencil Cleaning Systems

Express Newsletter: no clean solder wash white residue (931)

Partner Websites: no clean solder wash white residue (322)

No Clean | ITW EAE

ITW EAE | https://www.itweae.com/applications/electronic-assembly-materials/no-clean

Convection Reflow Selective Soldering Electronic Assembly Materials Adhesives Flux Lead-Free No Clean Solder Solder Paste Solvents Water Based Chemistries Thermal Processing Market Automotive

ITW EAE

SolderTip #38: Clean vs No-Clean Fluxes - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-38-clean-vs-no-clean-fluxes

SolderTip #38: Clean vs No-Clean Fluxes - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more


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water-based, pH neutral cleaning agent

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High Speed Precision In-Line SPI System - Mirtec MS-11
BGA and SMD Rework Stations

MIRTEC - the Global Leader in PCB INSPECTION Technology.