New Equipment | Solder Materials
Solder powders are the key component of all solder pastes. Pastes made with the same flux but with powders that differ in particle sizes often have different rheological/physical properties resulting in differences in screen/stencil printing, compone
Jetting is the best way to dispense many fluids quickly and accurately. The DJ-9000 has a high shot-generation rate, can be cleaned in a few minutes, and has fast changeover of wetted parts. Speed, Flexibility, Process Control, Experience Based on
Electronics Forum | Mon Jul 10 02:34:10 EDT 2017 | sachinverma
no
Electronics Forum | Wed Apr 16 10:45:16 EDT 2003 | Takfire
Recent cross-section analysis for a customer complaint revealed voiding in the solder fillet. In some cases, the remains of outgassing were also observed. During the failure analysis, we also observed failures where the solder fillet wicked on the
Used SMT Equipment | AOI / Automated Optical Inspection
Hello and thank you for your interest in our MVP Machine Vision Products AOI Machines For Sale. We have a total of (4) MVP Automated Optical Inspection Machines and (2) Inspection Repair Stations.. They were taken off line due to company closer. All
Used SMT Equipment | AOI / Automated Optical Inspection
Description: Hello and thank you for your interest in our MVP AOI Machines For Sale.We have a total of (2)Ultra 18-20 MVP Automated Optical Inspection Machines,(1)CentOS based server. They were taken off line due to new machine installation would
Industry News | 2016-11-01 19:52:12.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that CALTRONICS Design & Assembly, Inc., a PCB Manufacturing and Electronic Design Company, purchased an award-winning MV-6 OMNI 3D AOI Machine during SMTA International in Rosemont, IL.
Industry News | 2019-11-12 13:01:33.0
MIRTEC has won an EM Best of Industry Award in the category of Automated Optical Inspection for its MV-6e OMNI. The award was presented to Bentec Distributor Accurex during a ceremony that took place 26 September at the Stellar Gymkhana in India. Bentec is the Managing Partner for UK/Ireland and India for MIRTEC.
Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000. http://www.nordsonasymtek.com
The TR7500QE AOI offers high performance 3D solder and assembly inspection by combining the next generation multi-angle 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection and 4 side view cameras. Latest inspection softwa
Training Courses | | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Training Courses | | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Events Calendar | Wed Mar 14 00:00:00 EDT 2018 - Wed Mar 14 00:00:00 EDT 2018 | ,
Role of Bismuth in Lead-free Electronics - SMTA Webtorial
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing
AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control
AOI - Omron RNS_ptH, RNS-LS, VT-WIN2 VI3000 Marantz 22X IPC 610D certified ISO 9001-2008, etc automotive standards ROHS
| https://www.itweae.com/applications/electronic-assembly-materials/no-clean
Convection Reflow Selective Soldering Electronic Assembly Materials Adhesives Flux Lead-Free No Clean Solder Solder Paste Solvents Water Based Chemistries Solar Cell Firing/Drying Thermal Processing
| http://kvms.be/aim-solder.php
solder paste, liquid flux, cored wire, bar solder and more, on a global scale. M8 No Clean Solder Paste M8 NO CLEAN SOLDER PASTE is designed for the most demanding high density electronic assemblies
