Aoki Laboratories Ltd. is an ISO-9002 certified company specializes in manufacturing of Sn/Pb Bar Solder, Cored Wire and Paste.Environmental friendly products, such as: lead-free solder, no-clean non-halide solder flux, no-clean cored wire and Non-CFC cleaner, are compliance with ISO-14001 requirements.
Qualitek no-clean fluxes are formulated to meet the changing requirements for today's soldering operations. Designed for wave soldering conventional and SMT circuit board assemblies, these extremely low solids content fluxes leave practically no
Qualitek no-clean fluxes are formulated to meet the changing requirements for today's soldering operations. Designed for wave soldering conventional and SMT circuit board assemblies, these extremely low solids content fluxes leave practically no resi
Electronics Forum | Thu Jul 20 13:01:07 EDT 2000 | qsheng
What is the difference of formulation No-Clean Sn63 with No-Clean lead free paste? Is there techniocal data in detail for performance property of No-Clean lead free paste (for example, viscosity, solderability, tack, print life, reflow profile)? Is
Electronics Forum | Thu Sep 06 12:49:47 EDT 2001 | Daniel
I am trying to convert a customer from a water wash process to no-clean but am receiving much resistance. They suspect that no-clean residue played a part in field failures they experienced several years ago. They are quoting an AT&T study that state
RPS Rhythm SS Selective Soldering System In-Line Conveyor, L to R Board Flow Leaded and Lead Free Pots Drop Jet Fluxer (no clean flux) Spray Fluxer (water wash) Nitrogen SMEMA 208V Fully Functional FOB: Origin Contact Assured Technical Ser
In-Line Conveyor, L to R Board Flow Leaded and Lead Free Pots Drop Jet Fluxer (no clean flux) Spray Fluxer (water wash) Nitrogen SMEMA 208V Fully Functional FOB: Origin Contact Assured Technical Service LLC AssuredTechnicalServiceLLC@Gmail
Industry News | 2013-02-13 20:01:59.0
ZESTRON, is pleased to announce that ZESTRON America’s accredited application engineers will be presenting at the IPC APEX 2013.
Industry News | 2014-08-12 18:49:24.0
ZESTRON will host a free “Assembly, Cleaning, Coating, and Reliability” workshop together with Aqueous Technologies, Henkel and Quantum Systems in Scottsdale, AZ, on Tuesday, September 16th.
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Technical Library | 2020-03-09 10:50:17.0
A customer called the Helpline seeking advice for cleaning no-clean fluxes prior to applying a conformal coating. The customer's assemblies were manufactured with a no-clean rosin based solder paste (ROL0) and were cleaned with an isopropyl alcohol (IPA) wash. After cleaning, a white residue was sometimes found in areas with high paste concentrations and was interfering with the adhesion of the conformal coating (Figure 1). For conformal coatings to adhere properly, the printed circuit board (PCB) surface must be clean of fluxes and other residues. In addition, ionic contamination left by flux residues can lead to corrosion and dendrite growth, two common causes of electronic opens and shorts. Other residues can lead to unwanted impedance and physical interference with moving parts.
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Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
Career Center | , Minnesota USA | Engineering,Management,Production,Quality Control,Technical Support
Engineer with a diverse background in management, quality, computer and customer service. Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m
SMTnet Express April 11, 2013, Subscribers: 26336, Members: Companies: 13353, Users: 34557 No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability by: Todd L Kolmodin, VP Quality; Indium Corporation of America No-clean
SMTnet Express, February 9, 2017, Subscribers: 30,132, Companies: 15,113, Users: 41,841 Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue? Eric Bastow; Indium Corporation The SMT assembly world
SolderTip #38: Clean vs No-Clean Fluxes - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
EMPF PC0014 - Low Residue (No-Clean) Soldering Workshop Proceedings (Mar 1994) Login Account Wishlist Cart Toggle navigation Account Home Product Finder Advanced Search Contact Us Login Home > Publications > Digital Downloads