Industry Directory | Manufacturer of Assembled PCBs / Assembly / Contract Manufacturer / Service Provider
An ISO 9002 and ISO 14001 certified company and one of the leading electronic manufacturing service providers in the Philippines.
Industry Directory | Cleaning / Test Services / Consultant / Service Provider
Foresite is a process consulting house and analytial laboratory dedicated to solving product reliability challenges for electronics manufacturers.
New Equipment | Solder Materials
Qualitek no-clean fluxes are formulated to meet the changing requirements for today's soldering operations. Designed for wave soldering conventional and SMT circuit board assemblies, these extremely low solids content fluxes leave practically no
New Equipment | Solder Materials
Qualitek no-clean fluxes are formulated to meet the changing requirements for today's soldering operations. Designed for wave soldering conventional and SMT circuit board assemblies, these extremely low solids content fluxes leave practically no resi
Electronics Forum | Sat Feb 14 08:21:13 EST 2009 | davef
We believe that it's perfectly resonable for you to define the cleanliness that you require. We recommend that you leave it at that and not define the process or materials that your supplier use in meeting that cleanliness level. Start with a dirty
Electronics Forum | Mon Jul 30 21:03:44 EDT 2001 | davef
You should specify the level of res based on the effect of the res on the end-use of the product. J-STD-001 defines cleanliness requirements for ALL flux types, including water soluble and no-clean that you mention. 1 There is no equivalency betwee
Industry News | 2016-02-17 17:57:55.0
ZESTRON is pleased to announce that Umut Tosun, M.S.Ch.E., Application Technology Manager, ZESTRON, will present “PCB Cleanliness Assessment Methodologies – A Comparative Study” during the Cleanliness and ROHS Testing session on Thursday, March 17th at APEX 2016.
Industry News | 2013-02-13 20:01:59.0
ZESTRON, is pleased to announce that ZESTRON America’s accredited application engineers will be presenting at the IPC APEX 2013.
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Technical Library | 2010-06-10 21:01:48.0
This paper researches the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from boards soldered with no-clean and lead-free flux technologies.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | ONLINE | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Mon Jun 08 00:00:00 EDT 2020 - Mon Jun 08 00:00:00 EDT 2020 | ,
Practical Set-Up, Qualification of Cleaning Process in PCB Assembly
Events Calendar | Thu Oct 13 11:00:00 EDT 2016 - Thu Oct 13 11:00:00 EDT 2016 | Austin, USA
QFN: Design - Cleaning - Reliability: What you can't see can cause failure! Free Webinar
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
Career Center | tulsa, Oklahoma | Engineering
Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
Validity of the IPC R.O.S.E. Method 2.3.25 Researched Validity of the IPC R.O.S.E. Method 2.3.25 Researched This paper researches the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from
| https://store.aciusa.org/EMPF-PP0015-Low-And-No-VOC-Conformal-Coatings-Over-No-Clean-Flux-Residues-Aug-1995--P99.aspx
). Phase 1 evaluated the adhesion and performance of current (not lo-VOC) acrylic, polyurethane, silicone, and parylene conformal coatings applied over test pallets manufactured with no-clean (low residue) fluxes and pastes
ZESTRON Americas | https://www.zestron.com/sa/cleaning-applications/smt-electronic-cleaning/maintenance-and-tool-cleaning/dispensing-needles.html?%3Bamp%3Bamp%3Bamp%3Bamp%3BItemid=58&%3Bamp%3Bamp%3Bamp%3Bamp%3Bview=article
Center Cleanliness and Surface Qualification Ionic Contamination Test Ion Chromatography Technical cleanliness Visual Inspection Bath Analysis Cleaning Process Support Cleaning Trials Process
