BEST offers customized classes for SMT, Advanced SMT, and BGA Rework classes on site at your facility or at our headquarters near Chicago, Illinois. All classes are all taught by instructors who not only know the material, but have also performed the
2.5 PPM Signal sensitivity:
Electronics Forum | Wed Aug 02 03:25:17 EDT 2000 | wpeng
Thank you for your email. If you have any updated information on lead-free issues, please inform me. My Address is Mrs. Weiqun Peng Electronics/Hardware Integration Nokia Research Center Itamerenkatu 11 - 13 FIN-00180 Helsinki Finland Mobile: +358
Electronics Forum | Sun Nov 21 07:01:14 EST 1999 | Michael stephens
Charley, I have worked on QP242's for 1 and 1/2 years. It is a very reliable machine but like all machines, PM's are very important. When I first got to NOKIA I wasn't familiar with the QP's. Mostly IP3's, IP2's. We are placing 16 mil pitch parts
Hello Friends, We have very great condition FUJI NXT M3S Module from Nokia to sale or rent, we are the direct seller, from us, you can enjoy the good price. If you have demand, please kindly contact us. Best regards, TaJee Electronic Equipment
Industry News | 2018-08-21 19:55:30.0
The SMTA is pleased to announce its election results for the Global Board of Directors for the term beginning during SMTA International (October 14 - 18, 2018). Jeff Kennedy, Celestica, Inc. has been re-elected as President. Timothy Jensen, Indium Corporation, Richard Coyle, Ph.D., Nokia Bell Labs and Robert Kinyanjui, Ph.D., John Deere Electronics Solutions, Inc. were re-elected to the Board of Directors. Bill Cardoso, Ph.D., Creative Electron, Inc. has been newly elected to the Board of Directors.
Industry News | 2002-05-03 08:45:09.0
Taking Place September 22 Through 26, 2002
Technical Library | 2013-06-27 14:00:27.0
While IC level ESD design and the necessary protection levels are well understood, system ESD protection strategy and design efficiency have only been dealt with in an ad hoc manner. This is most obvious when we realize that a consolidated approach to system level ESD design between system manufacturers and chip suppliers has been rare. This White Paper discusses these issues in the open for the first time, and offers new and relevant insight for the development of efficient system level ESD design.
Technical Library | 2017-02-28 12:39:50.0
During the last 5 years mobile phones and other portable consumer electronics have been extremely popular and spread all over the world in different climate zones in very high volumes. At the same time the mobile phone terminal for many people has become a necessity that is brought with them in any activity they practice. These changes in user behavior have heavily changed the impact on handheld terminals from moisture, sweat, corrosive atmospheres and mechanical drop. As a result of this the requirement to solder joint reliability, corrosion stability and wear resistance are heavily increasing to keep a high reliability of the terminal.Immersion Ni/Au has been the overall dominant surface finish on Printed Wiring Boards (PWB's) for the last 10 years, but a paradigm shift to avoid use of this thin and porous surface finish is ongoing nowadays because it can’t address these challenges in a satisfactory way.In today's handheld terminals, Organic Solder Preservative (OSP) has replaced Immersion Ni/Au on solder pads. Carbon surface finish for Key- and spring contact-pads, combined with the right concept design can make use of Immersion Ni/Au unnecessary in the near future. The result will be higher reliability with less expensive and simpler processes.This paper will discuss the various considerations for choice of surface finish and results from the feasibility studies performed.
Events Calendar | Wed Apr 26 00:00:00 EDT 2017 - Wed Apr 26 00:00:00 EDT 2017 | Chicago, Illinois USA
IPC Reliability Forum: Manufacturing High-Performance Products
Events Calendar | Fri Mar 27 00:00:00 EDT 2020 - Fri Mar 27 00:00:00 EDT 2020 | ,
Optimizing Conformal Coating Coverage for Improved Environmental Corrosion Protection - Free Webinar
. Raiyo Aspandiar, Ph.D., Intel Corporation - Conference Director Richard Coyle, Ph.D., Nokia Bell Labs - VP of Technical Programs Dudi Amir, Intel Corporation Martin Anselm, Ph.D
— Leo Lambert of EPTAC Corporation recently visited Flextronics Industrial (Shen Zhen) Co., Ltd. / Flextronics Technology (Shen Zhen) Co., Ltd. in Xixiang, Shen Zhen, China and Nokia Telecommunications Ltd