New SMT Equipment: nokia black pad enig (1)

Multilayer PCB Fabrication

Multilayer PCB Fabrication

New Equipment | Fabrication Services

Multilayer PCB's ACI manufactures a wide variety of Multilayer PCB's for various applications spanning numerous industries and technologies.  We can build your high layer count PCB's using a wide variety of high speed low loss materials from epoxies

Advanced Circuitry International

Electronics Forum: nokia black pad enig (101)

enig

Electronics Forum | Mon Jan 03 16:34:10 EST 2005 | davef

The main advantage if ENIG over HASL is that ENIG is flat and HASL generally is not. The main disadvanages to ENIG over HASL are: * Cost of ENIG is 1.5 - 2X higher than HASL * Selflife is less than HASL * You solder to nickel, rather than copper * E

enig

Electronics Forum | Tue Jan 04 12:37:41 EST 2005 | Cmiller

We have been using this finish almost exclusively for fine pitch boards for about 5 years. Make SURE you use a board house that does the gold plating in-house. There are some potential issues as DaveF stated. The only problem we have encountered is w

Industry News: nokia black pad enig (5)

SMTA Technical Committee Dedicated to Strongest Technical Conference Yet

Industry News | 2003-03-31 09:51:04.0

The SMTA has formed the SMTA International Technical Committee for 2003.

Surface Mount Technology Association (SMTA)

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2017 Deadline for technical conference paper abstracts extended to: July 8, 2016

Industry News | 2016-07-02 06:45:13.0

IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017 to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017. The extended deadline is July 8, 2016.

Association Connecting Electronics Industries (IPC)

Technical Library: nokia black pad enig (20)

Identification and Prevention of "Black Pad"

Technical Library | 2013-01-17 15:34:33.0

The use of an electroless nickel, immersion gold (ENIG) surface finish comes with the inherent potential risk of Black Pad failures that can cause fracture embrittlement at the interface between the solder and the metal pad. As yet, there is no conclusive agreed solution to effectively eliminate Black Pad failures. The case studies presented are intended to add to the understanding of the Black Pad failure mechanism and to identify both the plating and the subsequent assembly processes and conditions that can help to prevent the likelihood of Black Pad occurring.

Jabil Circuit, Inc.

Solving the ENIG Black Pad Problem: An ITRI Report on Round 2

Technical Library | 2013-01-17 15:37:21.0

A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.

Celestica Corporation

Express Newsletter: nokia black pad enig (256)

Partner Websites: nokia black pad enig (4)

Call for Papers - SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm

-Computed Tomography Multiphysics Modeling Substrates and Finishes Thermal Management Tin Whiskers PCB Technology: Bio-Compatible Substrates Black Pad and Surface Finish Defects Conductive Anodic Filament (CAF

Surface Mount Technology Association (SMTA)

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

] Investigation Specifics:  84 I/O Plastic CSP, daisy chained, 0.3mm (12 mil) diameter solderballs  Sn63 solder paste  Test vehicle: Characteristics not available, Immersion Silver (IAg) and ENIG finishes  Thermal cycling: 0°C-100

Heller Industries Inc.


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