Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Thu Jul 03 03:23:04 EDT 2003 | loz
I have been advised recently about pcb manufacturers, that somehow or other supply pcb's with contamination. Visually they are fine, but problems arise during SMT manufacture, ie solder balling, non-wetting on pads, and also during wave solder proces
Electronics Forum | Mon May 12 12:58:07 EDT 2014 | emeto
Hello all, I have a diode(gold plated)on some assemblies that gives me a a hard time. The paste is wetting too good and climbs the lead of the component and touches the body which is a defect. I just wonder what if there is a way to heat the board e
| 1 |
