Industry News: non and wetting and gold and pad (Page 1 of 1)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Practical Components Supplies NEWLY UPDATED AIM Print Test Board and Kit

Industry News | 2010-04-10 23:59:50.0

LOS ALAMITOS, CA - Following the success of their 2007 test board and kit, Practical Components and Aim Solder have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacturers' assemblies.

Practical Components, Inc.

DEK and PacTech Join Forces for High-Volume Wafer Bumping Solution

Industry News | 2003-06-13 10:10:58.0

By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.

ASM Assembly Systems (DEK)

Henkel Chipbonder Compatible with Non-Contact Dispensing Technology; Enables Higher Throughput and More Uniform Dot Dimensions

Industry News | 2012-04-04 15:31:23.0

Known worldwide for surface-mount adhesive (SMA) development leadership, Henkel has set the industry benchmark with its high-performance Chipbonder brand adhesives. Within the company’s expansive portfolio of SMAs is

Henkel Electronic Materials

Nordson MARCH MesoSPHERE Plasma Systems Enable Very High Throughput Processing for 3D and Wafer-level Package Assembly

Industry News | 2018-02-01 20:18:01.0

Nordson MARCH introduces the MesoSPHERE™ Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level -handling wafers up to 450mm and panels up to 480mm. The MesoSPHERE's new, patented W3 three-axis symmetrical plasma chamber ensures that all areas of the wafer are treated equally and uniformly. Tight control over all process parameters gives highly repeatable results.

MARCH Products | Nordson Electronics Solutions

Indium Corporation to Showcase Innovative Solutions for Thermal Management and Power Electronics at SEMICON Taiwan

Industry News | 2023-08-29 07:11:55.0

Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.

Indium Corporation

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