BGA component types, characteristics, eutectic and non-eutectic solder, ceramics, determination of profiles, equipment, BGA removal, site preparation, reballing, soldering , cleaning etc.
New Equipment | Cleaning Agents
AQUANOX® A4651US is a low pH aqueous cleaning solution designed exclusively for use in ultrasonic immersion cleaning systems. AQUANOX® A4651US will provide brilliant solder joints with no sump side additives and cleans exceptionally well on the late
Electronics Forum | Wed Sep 10 17:08:08 EDT 2008 | slthomas
Isn't that the non-eutectic one that provides the pasty phase range that people use to clobber their tombstoning problems?
Electronics Forum | Wed Feb 08 03:44:28 EST 2006 | fctassembly
Hello Amol, I continue to be amazed at the surprise engineers have on discovering that a non-eutectic alloy such as SAC305 displays micro-cracking and rough joints in a soldering process. There was a reason the electronics industry chose to use eutec
Industry News | 2011-05-16 16:00:12.0
Nihon Superior announces that Keith Howell, Technical Director for the Americas, will present during the SMTA Ohio Valley chapter meeting on June 3, 2011 at the Dave and Busters in Hilliard, Ohio.
Industry News | 2012-09-12 17:00:31.0
Nihon Superior Co. Ltdwill introduce newly developed solder paste for low voiding in soldering processes and materials
Technical Library | 2020-04-01 23:32:29.0
Low temperature solder alloys are preferred for the assembly of temperature-sensitive components and substrates. The alloys in this category are required to reflow between 170 and 200oC soldering temperatures. Lower soldering temperatures result in lower thermal stresses and defects, such as warping during assembly, and permit use of lower cost substrates. Sn-Bi alloys have lower melting temperatures, but some of its performance drawbacks can be seen as deterrent for its use in electronics devices.Here we show that non-eutectic Sn-Bi alloys can be used to improve these properties and further align them with the electronics industry specific needs. The physical properties and drop shock performance of various alloys are evaluated, and their results are analysed in terms of the alloy composition, including Bi content and alloying additions.
Covering the industrial chain of power semiconductor materials, chips, modules, equipment and other industries, dozens of enterprises from home and abroad participated in the exhibition. This series of products can control the welding cavity rate of
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
Surface Mount International Technical Paper Format Requirements Non-Commercialism Policy · Technical papers and PowerPoint presentations perceived as sales presentations will not be accepted by the Technical Committee
Heller Industries Inc. | https://hellerindustries.com/recent-searches/
1812 ir China 1827 Non lga Gen 57174205 thermocouple assy 2039 reflow oven Heller mc 2000 Mc 2000 Lane 2043mk7 Circuit 8187 Cool can Computer fan speed control option i Fan speed control Efr Relay Options Description Dual oxygen Male elbow 2408 1500
