New Equipment | Rework & Repair Equipment
CX-3500 is use to examine internal solder joints, BGA, IC and other complex components.It adopts the structure of high resolution enhanced screen and sealed microcoking X ray tube combination, through X-ray non-destructive fluoroscopy, real-time obse
New Equipment | Rework & Repair Equipment
CX-3000A is use to examine internal solder joints, BGA, IC and other complex components.It adopts the structure of high resolution enhanced screen and sealed microcoking X ray tube combination, through X-ray non-destructive fluoroscopy, real-time obs
Industry News | 2004-06-24 17:35:13.0
New Lead-Free validation kit and service smoothes transition to "green" electronic assembly.
Industry News | 2019-05-31 08:50:57.0
Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis
CX-3500 is use to examine internal solder joints, BGA, IC and other complex components.It adopts the structure of high resolution enhanced screen and sealed microcoking X ray tube combination, through X-ray non-destructive fluoroscopy, real-time obse
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
40731 | https://www.smta.org/harsh/Harsh-Environments-Conference-Program-2020.pdf
Surface Mount Technology Association (SMTA)
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