Technical Library: nordson and mesa (Page 1 of 1)

Making Sense of Accuracy, Repeatability and Specification for Automated Fluid Dispensing Systems

Technical Library | 2013-11-14 10:43:40.0

Understanding accuracy and repeatability is an important step to analyze fluid dispensing system performance. They can also be prone to misinterpretation when reviewing a product specification. A dispensing motion system can be made to perform better or worse under different operating conditions. This article will explain accuracy and repeatability, and how they can be applied to different specifications. It will also discuss key considerations when interpreting accuracy and repeatability for decision making.

Nordson ASYMTEK

Combination of Spray and Soak Improves Cleaning under Bottom Terminations

Technical Library | 2014-10-23 18:10:10.0

The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components

KYZEN Corporation

Optimizing Thermal and Mechanical Performance in PCBs

Technical Library | 2008-02-04 12:13:38.0

Engineers are always striving to make a lighter, faster and stronger PCB. In order to achieve their designs, engineers must turn to alternative materials to enhance their designs. There are many materials that allow for thermal, coefficient of thermal expansion (CTE) and rigidity. Many times if a material enables an engineer to have CTE they will have to sacrifice thermal. Currently carbon composite laminates are being used in order to achieve an ideal PCB with thermal, CTE and rigidity with almost no weight premiums.

Stablcor

Trace, Track and Control: High Production Output at Low Costs

Technical Library | 2010-01-19 19:12:08.0

Learn how Trace, Track and Control (TTC) solutions help manufacturers cut cost, cut waste, automate critical manufacturing processes, and increase yields—all critical elements in today’s economic environment.

Microscan

Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components

Technical Library | 2020-05-07 03:46:27.0

The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.

Nordson SELECT

Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components

Technical Library | 2010-09-16 18:45:06.0

With PCB complexity and density increasing and also wider use of 3D devices, tougher requirements are now imposed on device inspection both during original manufacture and at their subsequent processing onto printed circuit boards. More complicated and de

Nordson DAGE

Design and Experiment of a Moving Magnet Actuator Based Jetting Dispenser

Technical Library | 2021-01-13 21:29:27.0

Developing actuators to drive high-frequency jetting dispensers in the dispensing technology for electronic assembly applications has become a concern in recent years. This study proposed a new jetting dispenser without a displacement amplification mechanism directly actuated by a moving magnet actuator (MMA) to jet small fluid droplets. In this article, the main geometric dimensions of ...

National Cheng Kung University

  1  

nordson and mesa searches for Companies, Equipment, Machines, Suppliers & Information

Nordson ASYMTEK
Nordson ASYMTEK

A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.

Adhesives / Dispensing / Assembly / Component Packaging / Manufacturer of Assembly Equipment

2747 Loker Ave. West
Carlsbad, CA USA

Phone: 760-431-1919

Sell Your Used SMT & Test Equipment

Repair tools for all your electronic circuit board repair needs.
IPC Training & Certification - Blackfox

Easily dispense fine pitch components with ±25µm positioning accuracy.


Best Reflow Oven