Industry News: nuclear interest materials natural atomic (2)

New Ultrasonic Coating System Advances Spray-On EMI Shielding Capabilities

Industry News | 2020-01-15 15:00:05.0

Sono-Tek Corporation (OTC BB: SOTK) announces the release of a new ultrasonic coating system, the FlexiCoat EMI, specifically designed for conformal spraying of EMI (Electromagnetic Interference) shielding material onto semiconductor packages. This new market is seeing growing interest and activity as a result of smaller devices requiring improved EMI shielding protection properties. Conventional techniques such as shield cans and SMT clips are inadequate for newer small devices. Ultrasonic coating is a cost-effective, faster and simpler alternative to expensive sputtering-based coating equipment.

SONO-TEK CORPORATION

Amtech to Acquire BTU International in an All-Stock Transaction

Industry News | 2014-10-23 16:44:17.0

Amtech Systems, Inc. (NASDAQ: ASYS) (“Amtech”) and BTU International, Inc. (NASDAQ: BTUI) (“BTU”) today announced that the companies have entered into a definitive merger agreement under which Amtech will acquire all the outstanding stock of BTU in an all-stock transaction.

BTU International

Technical Library: nuclear interest materials natural atomic (18)

New development of atomic layer deposition: processes, methods and applications

Technical Library | 2020-09-08 16:43:32.0

Atomic layer deposition (ALD) is an ultra-thin film deposition technique that has found many applications owing to its distinct abilities. They include uniform deposition of conformal films with controllable thickness, even on complex three-dimensional surfaces, and can improve the efficiency of electronic devices. This technology has attracted significant interest both for fundamental understanding how the new functional materials can be synthesized by ALD and for numerous practical applications, particularly in advanced nanopatterning for microelectronics, energy storage systems, desalinations, catalysis and medical fields. This review introduces the progress made in ALD, both for computational and experimental methodologies, and provides an outlook of this emerging technology in comparison with other film deposition methods. It discusses experimental approaches and factors that affect the deposition and presents simulation methods, such as molecular dynamics and computational fluid dynamics, which help determine and predict effective ways to optimize ALD processes, hence enabling the reduction in cost, energy waste and adverse environmental impacts. Specific examples are chosen to illustrate the progress in ALD processes and applications that showed a considerable impact on other technologies.

University of Johannesburg

Impact of Dust on Printed Circuit Assembly Reliability

Technical Library | 2013-05-09 14:35:18.0

Atmospheric dust consists of solids suspended in air. Dust is well known for its complex nature. It normally includes inorganic mineral materials, water soluble salts, organic materials, and a small amount of water. The impact of dust on the reliability of printed circuit board assemblies (PCBAs) is ever-growing, driven by the miniaturization of technology and the increasing un-controlled operating conditions with more dust exposure in telecom and information industries... First published in the 2012 IPC APEX EXPO technical conference proceedings.

CALCE Center for Advanced Life Cycle Engineering

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