China Automatic Solder paste printer for SMT assembly line Factory Supplier Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max: 850*500mm Weight Approx:1300Kg Product description: China Automatic Solder paste print
Flason SMT Automatic SMT 1200mm Solder paste printer for SMT assembly line Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max:1200*340mm Weight Approx:1500Kg Product description: Automatic1200mm SMT Solder paste p
Electronics Forum | Mon Aug 14 14:53:51 EDT 2017 | emeto
AIM, Indium , Alpha will be your top 3 choices. I did paste evaluation before with 4 paste manufacturers and Kester was my choice number 4. Profile according to the paste specs and observe results.
Electronics Forum | Thu Aug 10 07:29:43 EDT 2017 | stivais
How do you evaluate the soldering quality for those QFNs? X-Ray or AOI? For some QFNs (and other bottom termination components) it's not supposed to have solder fillets on toes. It's also noted in IPC-A-610 (Rev.F 8.3.13). Take a look at your QFN ch
Industry News | 2013-09-10 12:18:26.0
The Surface Mount Technology Association (SMTA)'s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt Lake City, Utah.
Industry News | 2014-06-17 21:50:29.0
SMT International has just introduced AMTECH VS-213 (a.k.a. the VOIDSTOPPER), a no-clean, lead-free solder paste formula that is 100% halogen-free based on all testing methods, including Oxygen Bomb Combustion and Ion Chromatography.
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components With PCB complexity and density increasing and also
Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO