Industry News: nxp qfn solderability wetting problems (Page 1 of 1)

SMTA Intermountain Chapter to Hold Annual Technical Symposium

Industry News | 2013-09-10 12:18:26.0

The Surface Mount Technology Association (SMTA)'s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt Lake City, Utah.

Surface Mount Technology Association (SMTA)

AMTECH Introduces a New Solder Paste, VS-213, Also Known as the Voidstopper

Industry News | 2014-06-17 21:50:29.0

SMT International has just introduced AMTECH VS-213 (a.k.a. the VOIDSTOPPER), a no-clean, lead-free solder paste formula that is 100% halogen-free based on all testing methods, including Oxygen Bomb Combustion and Ion Chromatography.

AMTECH

Plan your engineering process improvement with a monthly online webinar

Industry News | 2017-04-13 06:06:32.0

Solderability Benchmarking, Failures & Testing Methods 14th August All our webinars are based on 2.30pm UK time go to https://www.bobwillis.co.uk/events/ Benchmarking you PCB surface finish or the impact of baking boards or components can be simple in production and the laboratoy. Long term solderability of component terminations and printed circuit boards is fundamental in modern assembly processes. This is all practical experience not just theory for the presenters countless studies in industry

ASKbobwillis.com

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