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Electronics Forum | Mon Jun 17 21:16:19 EDT 2002 | davef
You�re correct about J-001. It�s interesting though, I find no references to controlling temperature and humidity as an element of an electrostatic discharge control program in the following: * ANSI/ESD S20-20 * "ESD Program Management" by Ted Dan
Industry News | 2011-03-09 14:01:30.0
In 2010, China's import and export volume of electronic and information products reached USD1.01 trillion in value. This figure reflects a growth of 29.3 percent, with exports accounting for USD591.2 billion, 37.5 percent of total national exports. These figures indicate how China has successfully managed the transition from a period of recovery to one of growth.
Technical Library | 2018-12-12 22:20:22.0
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-on-package (PoP) that offers a reduction in overall PCB board area requirements while allowing for increases in functionality. It utilizes standard, readily available device packaging methods in which high-density packaging is achieved by: (1) using standard "packaged" memory devices, (2) using standard 3-dimensional (3-D) interconnect assembly. The stacking approach provides a high level of functional integration in well-established and already functionally tested packages. The stack packages are built from TSOP packages with 48 leads, stacked either 2-high or 4-high, and integrated into a single dual-flat-no-lead (DFN) package.
Technical Library | 2015-09-10 15:06:17.0
A new non-halogen flame retardant has been developed and is useful for a variety of high performance applications. This non-reactive phosphorus-based material satisfies fire safety needs for a broad range of resins including epoxy, polyolefin, and polyamide. The combination of excellent flame retardant efficiency, high thermal stability and exceptional electrical properties is unique to this organophosphorus flame retardant and makes it a breakthrough technology for high speed, high frequency use in fast growing wireless and wired infrastructures. Resin performance data, including formulations with synergists, are presented in this paper.