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2 component resin meter mix dispense system 2 component glue potting machine 2 component ab glue dispenser ab resin dosing machine, ab resin mixing machine, Potting and encapsulation machine
ab component adhesive potting and encapsulation machine for PCBa assembly Whatsapp+86 13425164065 Our AB Potting machine helps AB compounds offer superior protection for electronic circuits industry Our Universal equipment is widely works for epo
Whatsapp+86 13425164065 The machine will have two tanks for keeping Liquid A & B separately. There are two sets of metering pumps inside the machine, draining out liquids individually from tank A & B. Liquid A & B mix with each other in the mixer
Electronics Forum | Thu Aug 06 12:49:41 EDT 1998 | justin medernach
| I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the
Electronics Forum | Fri Aug 07 01:02:51 EDT 1998 | zeek - just wanna to get a word in here
| | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t
Industry News | 2019-09-25 16:22:29.0
Nordson ASYMTEK announces that it has celebrated 20 years of supplying fluid dispensing equipment to Demant A/S, a world-leading manufacturer of hearing aid brands that include Oticon, Bernafon, and Sonic. During this history, Nordson technologies have enabled Demant to design smaller and more capable hearing aids.
Industry News | 2019-11-12 13:03:48.0
Easy set-up and very low flow rates for two-component fluids result in precise, small deposits and narrow lines
Technical Library | 2019-09-24 15:41:53.0
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications. The coatings consist of: Specialty (green transparent) liquid photoimageable solder masks (LPiSM) compatible with long-term thermal storage/stress in excess of 150°C. Combined with the appropriate high-temperature base material, and along with a suitable copper pre-treatment, these solder resists are capable of fulfilling higher thermal demands. In this context, long-term storage tests as well as temperature cycling tests were conducted. Moreover, the effect of various Cu pre-treatment methods on the adhesion of the solder masks was examined following 150, 175 and 200°C ageing processes. For this purpose, test panels were conditioned for 2000 hours at the respective temperatures and were submitted to a cross-cut test every 500 h. Within this test set-up, it was found that a multi-level chemical pre-treatment gives significantly better adhesion results, in particular at 175°C and 200°C, compared with a pre-treatment by brush or pumice brush. Also, breakdown voltage as well as tracking resistance were investigated. For an application in LED technology, the light reflectivity and white colour stability of the printed circuit board are of major importance, especially when high-power LEDs are used which can generate larger amounts of heat. For this reason, a very high coverage power and an intense white colour with high reflectivity values are essential for white solder masks. These "ultra-white" and largely non-yellowing LPiSM need to be able to withstand specific thermal loads, especially in combination with high-power LED lighting applications. The topic of thermal performance of coatings for electronics will also be discussed in view of printed heatsink paste (HSP) and thermal interface paste (TIP) coatings which are used for a growing number of applications. They are processed at the printed circuit board manufacturing level for thermal-coupling and heat-spreading purposes in various thermal management-sensitive fields, especially in the automotive and LED lighting industries. Besides giving an overview of the principle functionality, it will be discussed what makes these ceramic-filled epoxy- or silicone-based materials special compared to using "thermal greases" and "thermal pads" for heat dissipation purposes.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Full automatic model with 3 axis bi-component potting compound dosing and dispensing machine, whatsapp(0086 134 2516 4065) PGB-700 system accurately meters, mixes and dispenses two-component medium to low-viscosity materials for potting, gasketing,
SMT Express, Issue No. 1 - from SMTnet.com Volume 1, Issue No. 1 Thursday, June 3, 1999 Tricks of the Trade Optimizing Time/Pressure Dispensing ofAdhesives by Chrys Shea Return to Previous Page Over the past
GPD Global | https://www.gpd-global.com/fluiddispense-prod-islandseries.php
Tabletop Dispenser Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
ORION Industries | http://orionindustries.com/pdfs/200mp.pdf
. In addition, as a result of 3M’s innovative, proprietary process, 3M adhesive 200MP also offers the following excellent performance characteristics. Clarity
