Technical Library: orbotech discovery 8 (Page 1 of 2)

An Alternative Solvent with Low Global Warming Potential

Technical Library | 2015-02-05 20:25:41.0

In the past 20 yrs the solvent industry has gone through a great deal of change. In the early 1990s, CFC-113 and 1,1,1-trichloroethane were the workhorses of the industry. The Montreal Protocol to phase-out substances that deplete the Earth's protective Ozone Layer was implemented in the mid 1990s. After phase-out of the CFC solvents, the solvent industry fragmented to a variety of cleaning solutions. The electronics industry was a large user of CFC solvents and many of these applications changed to aqueous based cleaners (...) But those alternatives are now facing various problems: e.g. aqueous based cleaners use a lot of energy, require long drying times, use equipment that requires frequent maintenance, and require a large footprint; no-clean fluxes leave flux residues; and trichloroethylene and n-propyl bromide have toxicity issues. In response to these serious issues newer solvents and blends are being introduced in the marketplace

Honeywell International

Preparing for Increased Electrostatic Discharge Device Sensitivity

Technical Library | 2015-10-08 17:40:35.0

With the push for ever improving performance on semiconductor component I/O interfaces, semiconductor components are being driven into a realm which makes them more sensitive to electrostatic discharge, potentially increasing in sensitivity by 50% every 3-5 years. Today, the majority of modern day semiconductor components are being designed to meet 250Volts of charge device model sensitivity, and that could decrease to 125Volts in the next 3-5 years, and could again decrease to 50Volts-70Volts in the following 3-5 years. The entire electronics industry must prepare for this challenge.

Intel Corporation

Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates

Technical Library | 2018-12-05 14:52:23.0

The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications. The MLCC technologies have gone through a number of material and process changes such as the shift from precious metal electrode (PME) configurations which were predominantly silver/palladium to base metal electrodes (BME) dominated by nickel. Each of these changes were accompanied by both quality and reliability problems. The MLCC industry is now in the midst of an unprecedented set of challenges similar to the Moore’s Law challenges being faced by the semiconductor industry. While capacitor failures have historically been responsible for a significant percentage of product field failures (most estimates are ~30%) we are seeing disturbing developments in the low voltage (

DfR Solutions

Cleanliness of Stencils and Cleaned Misprinted Circuit Boards

Technical Library | 2010-09-09 16:44:48.0

The effectiveness of cleaning stencils and misprinted/dirty printed circuit boards can be effectively monitored. This can be done by washing known clean circuit boards and then checking to see if they have stayed clean as a result of the washing process.

Research In Motion

Lean Six Sigma Approach to New Product Development

Technical Library | 2017-08-02 20:18:21.0

In this rapidly moving electronics market, fast to market with new products is what separates top performing companies from average companies. A survey conducted by Arthur D. Little revealed that "New-Product Development (NPD) productivity in atop performing company is five times what it is in the average company. The top performer gets five times as much new product output for the same investment." What do they know that the rest of us do not? One winning factor is the use of the Robert Cooper process. (...)This paper will present a Lean Six Sigma approach to "right sizing" the Stage Gate process to be efficient, practical, and easy to manage. Various tools of Stage Gate, along with proven best practice, will be covered. In addition, a reduced Stage Gate model will be discussed for simple, low risk projects.

MacDermid Inc.

Copper Wire Bond Failure Mechanisms.

Technical Library | 2014-07-24 16:26:34.0

Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.

DfR Solutions

Strength of Lead-free BGA Spheres in High Speed Loading

Technical Library | 2008-04-08 17:42:27.0

Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension.

Nihon Superior Co., Ltd.

Screen and Stencil Printing Processes for Wafer Backside Coating

Technical Library | 2009-09-09 15:08:19.0

Stencil printing equipment has traditionally been used in the surface mount assembly industry for solder paste printing. In recent years the flexibility of the tool has been exploited for a wide range of materials and processes to aid semiconductor packaging and assembly. One such application has been the deposition of adhesive coatings onto the backside of silicon wafers.

ASM Assembly Systems (DEK)

Precision Cleaning in 21st Century: New Solvent with Low Global Warming Potential

Technical Library | 2012-11-15 23:38:50.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. As we progress in the 21st century, electronics manufacturing will need more and more precision. Parts will get more complex since more components have to be assembled in smaller spaces. Circuit boards and other electronic assemblies will become more densely populated; spacings between components will be shorter. This will require precision manufacturing and efficient cleaning during and post manufacturing. In addition, with population and technology progressing, larger amount of greenhouse gases will be emitted resulting in higher global warming. Intense research effort is going on to develop new generation of chemicals to address both cleaning and global warming issues. Low global warming solutions in refrigeration and as insulating agents are already in the marketplace.

Honeywell International

Counterfeit Electronic Components Identification: A Case Study

Technical Library | 2018-09-12 21:04:28.0

Counterfeit electronic components are finding their way into today’s defense electronics. The problem gets even more complex when procuring DMS (diminishing manufacturing source) parts. This paper will provide a brief introduction to counterfeit prevention and detection standards, particularly as they relate to the Aerospace and Defense sector. An analysis of industry information on the types and nature of counterfeit components will be discussed in order to illustrate those most likely to be counterfeited, followed a specific case at a major defense contractor.

Northrop Grumman Corporation

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