Electronics Forum | Thu Dec 16 04:14:16 EST 2010 | kemasta
Hi, I am new in this industrial. I learnt that PCB may absorb moisture and eventually caused delaminate after heat apply on it (reflow or wave). But I don't quite understand, if the PCB was keep in sealed bubble bag, and with the humidity control wit
Electronics Forum | Thu Nov 30 00:41:23 EST 2017 | abhilash4788
Dear All, I have OSP finsh pcb on my production, the pcb thickness is 1.5mm and the product is one sideded pcba. After reflow process, Is there any specific time frame defined for smt completed OSP finish pcba before going for wave soldering proce
BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension
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