Qualitek no-clean fluxes are formulated to meet the changing requirements for today's soldering operations. Designed for wave soldering conventional and SMT circuit board assemblies, these extremely low solids content fluxes leave practically no resi
This unique patented alloy has been developed as a lead free alternative for those now using costly SAC alloys and for those switching from lead containing Sn63/Pb37 alloys to the lead free process. SN100e is manufactured from tin, copper, and cobalt
Electronics Forum | Wed Jan 21 16:55:22 EST 2004 | patrickbruneel
Hi, Are you testing bare boards or soldered boards. Are the test probes in contact with soldered pads or contacting the copper with the osp coating (not soldered). If you could clarify this it would be easier to give some hints for probable causes.
Industry News | 2012-05-02 00:59:26.0
Umut Tosun, Application Technology Manager at ZESTRON will present “Maintaining OSP Coating Integrity During the Cleaning Process” at the International Conference on Soldering and Reliability in Toronto, Ontario, Canada.
Industry News | 2012-05-07 06:48:17.0
Umut Tosun, Application Technology Manager at ZESTRON, the globally leading provider of high precision cleaning products and services, will present “Maintaining OSP Coating Integrity During the Cleaning Process” at the International Conference on Soldering and Reliability in Toronto, Ontario, Canada.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2019-06-11 09:36:13.0
An experiment was recently performed ACI Technologies for a customer that was interested in comparing the wetting of lead-free solders with varying temperature profiles and atmospheric conditions. In order to deliver an objective measurement of solder wetting (in addition to subjective inspection analysis), a simple wetting indicator pattern was added to the solder stencil in an area on the test vehicle that had exposed and unused copper.
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
SMT Express, Volume 5, Issue No. 8 - from SMTnet.com Equipment Impacts of Lead Free Wave Soldering The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today’s Wave Solder systems. Users
SMTnet Express, February 16, 2017, Subscribers: 30,171, Companies: 15,128, Users: 41,915 Component Level Reliability For High Temperature Power Computing With SAC305 And Alternative High Reliability Solders Thomas Sanders, Sivasubramanian
. James Hall are divided into 11 modules each with slides and a quiz on the following updated topics: PCB Basics and Surface Finishes like HASL and ENIG Surface Finishes like OSP, Immersion Tin, Immersion Silver Paste, stencils, printing and how they are interrelated Component placement with a focus
. The test boards were fabricated with Panasonic R-1755V high temperature PCB laminate and Entek HT Plus organic solderability preservative (OSP) final finish