Industry News: oval (Page 1 of 1)

Count On Tools Introduces Ceramic Nozzles for UIC’s Placement Equipment

Industry News | 2011-01-28 17:29:19.0

Count On Tools Inc. introduces new Ceramic Nozzle Series for the complete line of Universal Instruments Corporation’s (UIC) pick-and-place machines, including Genesis, Advantis, Flexjet and GSM.

Count On Tools, Inc.

Count On Tools Releases Juki 509 Ceramic Nozzles for 0201 Components

Industry News | 2011-03-31 10:59:52.0

Count On Tools now offers redesigned Juki 509 Ceramic Nozzles in both gold and silver styles. This nozzle design enables highly accurate, repeatable, optimized chip placement for 0201 micro-components.

Count On Tools, Inc.

Japan Unix Can Reduce PCB Burning Issues with Optimal Laser Shape Rings

Industry News | 2015-06-02 13:26:13.0

Japan Unix introduces laser shape rings. Choosing the best laser spot shape to fit components and land shapes can reduce circuit board problems.

Japan Unix Co., Ltd.

New Yorker Electronics Distributes Streamline Avionics' Metallized Polyester Capacitors

Industry News | 2020-12-21 09:09:35.0

SA's Round, Oval and Box Radial General Purpose Capacitors Supply Excellent Dielectric Strength and Volumetric Efficiency at Low Cost

New Yorker Electronics

DuPont Circuit & Packaging Materials Introduces Pyralux® TK Flexible Circuit Materials for High Speed and High Frequency Printed Circuit Boards

Industry News | 2010-04-12 16:09:04.0

RESEARCH TRIANGLE PARK, N.C. — DuPont Circuit & Packaging Materials (CPM) introduced its newest high-performance laminate for printed circuit boards. DuPont™ Pyralux® TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. DuPont™ Pyralux® TK delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today.

DuPont

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