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The BEST Gold Contact Replating Kit includes the tools you need for fast replating and modification of circuit contacts. Edge contacts may require replating if they are contaminated with solder or become scratched during handling or do not meet the m
Adhesion Promotion Electronics Coatings Increase the bond strength, eliminate delamination, and improve reliability of difficult to bond substrates. Aculon's non-stick, adhesion promotion and anti-oxidation coatings can be used on a broad range of
Electronics Forum | Mon Feb 19 17:34:02 EST 2007 | GS
Thank You Pavel and Dave, Unfortunately I do not have IPC-4554. Anyway I 0.6-1.0umm is what I remember, and confirmed by reading also through leterature available on google. I was just going to understand if it possible to obtain more thickness
Electronics Forum | Fri Sep 12 13:14:33 EDT 2003 | Mark Kostinovsky
A little adition to Norm's statement: Sn-Pb intermettalic compounds do not accept solder as they are (even without being oxidized).
Industry News | 2016-01-05 13:57:47.0
Barry Industries announces the introduction of a RoHS-compliant flange mount RF termination, T50R0-500-15X, which dissipates 500W with favorable return loss over a DC to 4.5GHz bandwidth. Barry Industries is an ISO9001:2008 certified ITAR registered manufacturer of high quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging.
Industry News | 2008-04-22 20:10:56.0
Shimadzu Scientific Instruments: A high-performance, general-purpose instrument, the EDX-720 offers an array of features to deliver enhanced performance and operation, and is an ideal instrument for demanding regulatory compliance measurements such as RoHS and ELV
Technical Library | 2014-10-16 16:39:12.0
Key points are: *Long-term storage of BGA & QFP products may be required due to: Fab and assembly factory transfers Product obsolescence requiring customers make lifetime/EOL purchases Providing extended service (10+ years) on vehicles Other program needs * Integrity of EOL products in terms of solderability needs to be verified.
Technical Library | 1999-05-07 08:50:40.0
To enable transistor scaling into the 21st century, new solutions such as high dielectric constaConventional scaling of gate oxide thickness, source/drain extension (SDE), junction depths, and gate lengths have enabled MOS gate dimensions to be reduced from 10mm in the 1970’s to a present day size of 0.1mm. To enable transistor scaling into the 21st century, new solutions such as high dielectric constant materials for gate insulation and shallow, ultra low resistivity junctions need to be developed. In this paper, for the first time, key scaling limits are quantified for MOS transistorsnt materials for gate insulation and shallow, ultra low resistivity junctions need to be developed.
BEST Inc master instructor Norman Mier demonstrates how to replate gold fingers using the BEST gold contact replating kit. In this video he demonstrates how to repair, prepare and replate the finger using a gold replating solution. If you want to lea
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
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. The plating thickness is too thin or the result of poor processing, which can be easily damaged during assembly; The soldering temperature is not high enough
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
adventitious carbon [9] and nickel oxidation due to pinholes in the gold, the surface of gold will not change with time. The thickness of indium oxide (In2O3) follows a parabolic growth curve [10]. As a solid the growth rate is minimal. A sample in air at 145°C
