| https://www.eptac.com/ask/vapor-phase-soldering-to-immersion-tin-plated-pads/
. The characterization of the thin oxide layers were studied by using high resolution analysis methods as XPS, TEM, and SERA. The results proved a thickness of immersion tin oxide layers at approximately 7 nm by TEM and XPS analysis after plating
| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print
. The plating thickness is too thin or the result of poor processing, which can be easily damaged during assembly; The soldering temperature is not high enough
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
adventitious carbon [9] and nickel oxidation due to pinholes in the gold, the surface of gold will not change with time. The thickness of indium oxide (In2O3) follows a parabolic growth curve [10]. As a solid the growth rate is minimal. A sample in air at 145°C
ORION Industries | http://orionindustries.com/pdfs/silpadk10.pdf
. SP K-10 is designed to replace ceramic insulators such as Beryllium Oxide, Boron Nitride, and Alumina. These insulators are expensive and they break easily
| http://etasmt.com/te_news_industry/2021-09-01/24564.chtml
. The plating thickness is too thin or the result of poor processing, which can be easily damaged during assembly; The soldering temperature is not high enough
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-fabrication-process/
. Oxide and Lamination With all of the layers etched, a chemical treatment called oxide is applied to the inner layers of a printed circuit board to improve the strength of the bond
ORION Industries | http://orionindustries.com/pdfs/formex.pdf
FORMEX GK/FORMEX FLAME RETARDANT POLYPROPYLENE DATA SHEET TEST METHOD FORMEX-10 FORMEX GK-10 FORMEX GK-17 FORMEX GK-30 FORMEX GK-40 COLOR NATURAL NATURAL/BLACK NATURAL/BLACK NATURAL/BLACK NATURAL/BLACK THICKNESS-INCH .010 + .003/ –.0015 .010 + .003/ –.0015 .017 + .003/ –.001 .030 ± .002 .040
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
). F Fillet Solder formation at the intersection of surfaces of a solder connection. Fine Pitch Centerline spacing of leads 0.5 mm (20 mils) or less. Flux A material that cleans metal surfaces of absorbed gases, oxide films, and other surface contaminants
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
). F Fillet Solder formation at the intersection of surfaces of a solder connection. Fine Pitch Centerline spacing of leads 0.5 mm (20 mils) or less. Flux A material that cleans metal surfaces of absorbed gases, oxide films, and other surface contaminants
| http://etasmt.com/cc?ID=te_news_industry,24163&url=_print
). If preheat temperature is too low, flux may not be activated fully. Preheat time: It depends on the component with highest heat capacity, PCB area, PCB thickness and performance of solder paste used. Generally, 80~160
