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Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
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! Newsletter Email Address: Click here to unsubscribe Test and Measurement Equipment Home > Test and Measurement Equipment 413 item(s) - Page 1 of 18 Items 24 48 72 Sort Best match New arrivals Name Product ID Highest price Lowest price View Text Single column Double column Two column Two column box Three column Flexible Accuthermo
