Industry News: pac-tech (Page 1 of 2)

Pac Tech USA Offering Contract Wafer Bumping, Stencil Services

Industry News | 2003-01-27 10:27:31.0

At a New Facility Within the Company's U.S. Headquarters

SMTnet

International Wafer-Level Packaging Conference (IWLPC) Concludes on a Positive Note

Industry News | 2009-11-06 17:10:00.0

Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce the the 6th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success. The IWLPC was held October 27-30, 2009 at the Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and On-line Registration Now Open

Industry News | 2009-07-24 14:12:49.0

Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Features Five Half-Day Tutorials

Industry News | 2009-08-07 19:24:15.0

Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce five half-day tutorials for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

SMTA Announces IWLPC 2010 Featured Tutorials

Industry News | 2010-08-17 14:08:36.0

The SMTA and Chip Scale Review magazine are pleased to announce six half-day tutorials for the 7th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

Peter Ramm, Fraunhofer EMFT, to Give Opening Presentation at International Wafer-Level Packaging Conference (IWLPC)

Industry News | 2010-09-02 11:07:09.0

The SMTA and Chip Scale Review magazine are pleased to announce Peter Ramm, Fraunhofer EMFT, as the Opening Speaker at the 7th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference Moving Toward Largest Program in Its History

Industry News | 2008-08-14 14:03:27.0

San Jose, CA � This year's fifth annual International Wafer-Level Packaging Conference (IWLPC), October 13-16, will be the largest ever, according to Dr. Ken Gilleo, IWLPC general chair.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Concludes Successfully

Industry News | 2010-10-20 21:21:00.0

The SMTA and Chip Scale Review magazine are pleased to announce the 7th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success. The IWLPC was held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Concludes Successfully

Industry News | 2011-11-08 15:31:27.0

The SMTA and Chip Scale Review magazine are pleased to announce the 8th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success.

Surface Mount Technology Association (SMTA)

Seven IPC APEX EXPO™ Technical Conference Sessions Go Global - Live From Las Vegas

Industry News | 2011-01-20 13:45:14.0

IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.

Association Connecting Electronics Industries (IPC)

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