Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied
Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar
Electronics Forum | Sat Jun 06 09:53:59 EDT 1998 | Earl Moon
GEOMETRIC DIMENSIONING AND TOLERANCING (GDT) Using and applying GDT to printed circuitry and assemblies is very much like applying it to any other design for manufacturing (DFM) or design for assembly (DFA) requirement using concurrent engineering (C
Electronics Forum | Thu Jan 27 13:05:32 EST 2005 | reash
Thanks for the feedback. I'd still like to know what you guys think about Pace. Maybe we'll look into their MBT-250-SDPT Repair System (http://www.paceworldwide.com/_ShowSystemDetails.asp?ProductGroupID=2∏uctID=26 ). Or maybe even a very low-end R
Electronics Forum | Thu Jan 27 06:39:59 EST 2005 | reash
For now, on this first board, we will be reworking components such as 0805 and 1210 size caps and resistors, along with SOT-23 and SC-70 size packages. We might eventually get into BGAs. This board will most likely be a double-sided board, probably
Electronics Forum | Fri Jan 28 09:30:07 EST 2005 | reash
Well the powers that be actually want to go with a regular rework station, for future growth. I guess they plan on using BGAs sometime in the near future. We're also planning on using a D-Pak device in this first board. So now we're looking at the
Electronics Forum | Mon Dec 20 19:59:27 EST 1999 | se
Printer and Pick/Place manufacturers will often take used equipment in trade from potential customers that want to buy new, if they know they can sell it. Inquire to the manufacturers for used or refurbished models they sell and support. If you buy a
Electronics Forum | Fri Jan 08 15:02:38 EST 1999 | Dave F
| HI! I am a package engineer in Korea. I have some reasons | to desolder excessive solder at the lead of TSOP and TSOJ | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. | Does anyone
Electronics Forum | Sat Aug 15 07:56:16 EDT 1998 | Clyde F.
| | We need BGA rework station and x-ray inspector recently in urget case, Do you have any information to rework FPGA package and inspect them during processing. | Thx for any information | Best Regards, | Stoney Tsai PACE just came out with a new s
Electronics Forum | Wed Jul 22 13:57:03 EDT 1998 | bill
| | We need BGA rework station and x-ray inspector recently in urget case, Do you have any information to rework FPGA package and inspect them during processing. | Thx for any information | Best Regards, | Stoney Tsai If you are doing any reballing
Electronics Forum | Fri Jan 08 19:47:55 EST 1999 | Kwang-Seong Choi
| | HI! I am a package engineer in Korea. I have some reasons | | to desolder excessive solder at the lead of TSOP and TSOJ | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. | | Does
