Nordson Dage XD7600NT500 X-Ray Inspection System with X-Plane Analysis - Datest was one of the first users of the X-Plane algorithm. We now have 3 years of experience using X-Plane. It is a very powerful tool for detecting head-in-pillow (HiP) de
Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package
Electronics Forum | Fri May 01 08:15:36 EDT 2009 | davef
Scavenging Methods [Improve Solder Scavenging of Large Area-array Sites, SMT, Laurence Harvilchuck, process research engineer, Unovis Solutions, harvilch@unovis-solutions.com] Two common methods exist for scavenging residual solder on the site for s
Used SMT Equipment | Pick and Place/Feeders
(8) Fuji NXT M3S modules on (1) 8M independent base Need a different configuration? Heads can be custom configured to your requirement: H12S, H08, H04, H01 Package-on-package setup available Modules and bases can be added or subtracted
Used SMT Equipment | Pick and Place/Feeders
(1) Fuji NXT M6S modules on (1) 2M independent base with optional TUL Need a different configuration? Heads can be custom configured to your requirement: H12S, H08, H04, H01 Package-on-package setup available Modules and bases can be
Industry News | 2010-01-22 21:34:29.0
SMTA will offer several new webinars in conjunction with Virtual PCB. Tentative topics include Lead-free alloys, Package-on-Package, and cleaning practices, among others. The complete webinar schedule will be finalized the first week in February, so stay tuned for more.
Industry News | 2012-07-12 10:34:27.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Technical Library | 2015-01-28 17:39:34.0
Stacking heterogeneous semiconductor die (memory and logic) within the same package outline can be considered for less complex applications but combining the memory and processor functions in a single package has compromised test efficiency and overall package assembly yield. Separation and packaging the semiconductor functions into sections, on the other hand, has proved to be more efficient and, even though two interposers are required, more economical. The separated logic and memory sections are configured with the same uniform outline for vertical stacking (package-on-package). The most common configuration places the logic section as the base with second tier memory section soldered to a mating contact pattern. This paper addresses the primary technological challenges for reducing contact pitch and package-on-package interface technology.
Technical Library | 2021-01-13 21:34:29.0
Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient of thermal expansion mismatch between Si chips and polymer substrates induces thermal warpage during the reflow process. As such, the reflow temperature and reliability of solder joints are critical aspects of PoP. Although Sne58Bi is a good candidate for low-temperature processes, its brittleness causes other reliability issues. In this study, an in-situ observation was performed on composite solders (CSs) made of ...
ALPHA® Preforms with solder paste adds solder volume.
The KE302V is a 7th generation modular placement machine from Juki and represents the latest leading-edge technology for improved flexibility and production quality. It supports a hybrid feeder mix of electronic and mechanical feeders with up to 160
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | San DIego (Mira Mesa), California USA | Engineering,Maintenance,Production
Duties: Supports, develops and optimizes manufacturing processes. Reviews quality metrics to help produce high quality, repeatable processes. Assists with supporting and improving the SMT process (print process, placement, reflow, package-o
SMTnet Express, January 28, 2015, Subscribers: 22,279, Members: Companies: 14,195 , Users: 37,607 BVA: Molded Cu Wire Contact Solution for Very High Density Package-on-Package (PoP) Applications Vern Solberg, Ilyas Mohammed - Invensas Corporation
Whizz Systems | https://www.whizzsystems.com/package-design-simulation/
. We provide services in different techniques of Package Designing like: Wire Bonding Flip chip We also have expertise in Chip-on-Board (COB) PCB designs
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF8-Doc-Package-801-1-01.pdf
CF8 Documentation Package Documentation Package for CF-8 Axial Component Lead Former PN 801-1-01 version 2.0 03/22/2021 CONTENTS of CF-8 Documentation Package Operating Guide In addition to installation, set up, and operating procedures, this guide includes electrical schematics and maintenance
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