Industry News: pad contamination under kapton tape (Page 1 of 1)

Flextac Self-Adhesive Stencils Simplify BGA Rework

Industry News | 2001-02-26 11:18:45.0

Innovative Flextac Stencils simplify BGA rework. These self-sticking laser cut, polymer solder paste stencils use a residue-free adhesive similar to Post-it Notes to seal around BGA pads to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.

Circuit Technology Center, Inc.

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

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