Industry Directory | Manufacturer
A manufacturer of desoldering braid (wick) with an emphasis on continuing advancement in soldering/desoldering technology, visual and x-ray inspection systems, fume extraction, and solder paste inspection systems.
Industry Directory | Manufacturer
Porous ceramic vacuum chuck table or Polishing Chuck table supplied to semiconductor industry for silicon wafer dicing or finishing purposes. This product is an uniform compact frame, high strength, g
New Equipment | Board Handling - Conveyors
Soldering PCB Rework Conveyor 1. Modular design 2. Weighted design improves stability 3. Smooth and parallel width adjustment (screw) 4. PCB detection mode 5. Customizable equipment length 6. Adjustable transport speed 7. SMEMA 8. Motor drive 9. Hig
New Equipment | Board Handling - Conveyors
Soldering PCB Rework Conveyor 1. Modular design 2. Weighted design improves stability 3. Smooth and parallel width adjustment (screw) 4. PCB detection mode 5. Customizable equipment length 6. Adjustable transport speed 7. SMEMA 8. Motor drive 9. Hig
Electronics Forum | Fri Mar 24 08:32:17 EST 2006 | davef
Lifted pads are almost always caused by pad to substrate adhesion likely degraded significantly after too much heat. Poorly trained operators armed with soldering irons can do this expertly.
Electronics Forum | Tue May 19 03:19:33 EDT 2009 | cunningham
Has anyone used a hot press to bond new pads to the boards if they have been lifted? we have one and have tried and carried out some DOE's on FR4 boards but when trying the same settings on Polyamide they basically fell of can anyone give any pointe
Used SMT Equipment | Screen Printers
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Used SMT Equipment | Screen Printers
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Industry News | 2004-09-07 18:32:13.0
NORTHBROOK, Ill., September, 2004
Industry News | 2022-11-22 06:14:08.0
Full-auto SMT Stencil Printer is indispensable equipment in SMT production Line. It is generally composed of board mounting, solder paste, imprinting, and circuit board transfer. Widely used are Full-auto SMT Stencil Printer and semi-auto SMT Stencil Printer These two types, next, let's share with you the operating instructions of Full-auto SMT Stencil Printer.
Parts & Supplies | Assembly Accessories
Samsung CP Feeder; CP8 * 2MM CP8 * 4MM CP12 MM CP16 MM CP24 MM CP32 MM CP44 MM CP56 MM Samsung CP Feeder Accessories; Feed gear, pressure cover, lock buckle, connecting rod, push rod, spacing screw, beak, one-way bearing, roll wheel, spring, etc..
Parts & Supplies | Pick and Place/Feeders
We also supply following Simens Spare parts : 00358497-02 Cable HS50, Comp. Illum.Control, modular 00358644-02 KIT ELECTRIC HEAD CRASH SENSOR 00358653S04 Lifting Table Single transport 00358654S04 Lifting Table Dual transport 0035867
Technical Library | 2017-09-07 13:56:11.0
As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.
Technical Library | 2017-08-31 13:43:48.0
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction
00359433-01 Reflection Light Barrier, configured 00359434-01 Crash Light Barrier,configured 00359435-01 Neutral Position Light Barrier 00359436-01 Unlock Device WTC 00359438-01 Connection Cable: Power MTC 00359459-01 LIFTING TABLE SINGLE CONVEYO
03059051-01 Lifting Table Dual Conveyor X4i 03059195-01 Retrofit kit pneumatic unit D1 03059196-01 Gas Spring 400N ( for D1/D2 Left Hood) 03059238S01 Linear Dipping Unit (LDU) Basis 03059375-01 Starter kit filter disc 2-parts / C+
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
| http://etasmt.com/cc?pageID=newsList&ID=te_news_news,0&pNum=7
. It supplies magazine racks directly to a lift... Show Details Magazine Unloader- All type Located at the final stage of the SMT line, this unit stacks PCBs in an empty magazine rack using a pneumatic pusher one by one
Blackfox Training Institute, LLC | https://www.blackfox.com/4-common-errors-in-smt-assembly/
. Among its many causes, excess solder is the most common culprit. Other causes are high temperatures, moistures, cold slumps, or a problem during the solder paste printing process where the stencil arrangement of the PCB pad configuration is off its mark
