Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
For over 30 years, V-TEK International has been a global leader in the electronic component packaging and processing industry by providing cost-effective component packaging and processing options with fast return on investment.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
New Equipment | Rework & Repair Equipment
The BEST PCB Epoxy Repair Kit can be used to repair lifted pads and traces as well as build up and repair edge corner damage to PCBs or repair solder mask which has been damaged or removed. By adding colorants a pcb color epoxy kit can be made up cus
Electronics Forum | Fri Sep 02 06:47:17 EDT 2005 | dougs
Is there a standard that we should aim for in respect to the strenght of the solder on SMT leads? We have a customer who are testing our product by pulling leads off of pads then returning them.
Electronics Forum | Fri Sep 02 09:02:10 EDT 2005 | dougs
you tell me, the customer has started to pull at some of the leads of some IC's with tweezers while de-bugging boards that had failed in the field, he was able to pull some of the leads away from the solder joints, we feel he may be over-doing it a
Used SMT Equipment | In-Circuit Testers
Rohde & Schwarz FSH18 Handheld Spectrum Analyzer 10MHz - 18GHz Handheld Spectrum Analyzer 10MHz - 18GHz, RBW 100Hz - 1MHz, LCD color display The R&S FSH18 is the perfect handheld tool in the field for many different applications such as servi
Used SMT Equipment | In-Circuit Testers
Rohde & Schwarz FSH18 Handheld Spectrum Analyzer 10MHz - 18GHz Handheld Spectrum Analyzer 10MHz - 18GHz, RBW 100Hz - 1MHz, LCD color display The R&S FSH18 is the perfect handheld tool in the field for many different applications such as servi
Industry News | 2009-04-15 23:01:13.0
BANNOCKBURN, Ill., USA, April 2, 2009 � IPC � IPC � Association Connecting Electronics Industries� has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31�April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Industry News | 2016-09-14 17:44:33.0
IPC – Association Connecting Electronics Industries® will present “PCB Troubleshooting” on November 2, 2016 in Raleigh, N.C. in conjunction with regional trade show, PCB Carolina.
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
Technical Library | 2015-02-19 16:54:34.0
Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method with solder ball attached and positioning the test board at an angle of 30º is employed to study the strength of pad cratering. This new method clearly reveals the failure mechanism. And a proper way to interpret the finite element analysis (FEA) result is discussed. Impact of pad dimension, width and angle of copper trace on the strength is included. Some findings not included in previous research could help to guide the design for better performance
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
PCB pad repair technique demonstrated using the 2-part epoxy method. More on this PCB pad repair technique: http://www.solder.net/services/pcb-repair/pad-and-trace-repair/ More on the recommended epoxy: http://www.soldertools.net/pcb-repair-epoxy-r
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
ORION Industries | http://orionindustries.com/pdfs/silpad400.pdf
, .007 in. Sil-Pad 400, .009 in Sil-Pad 600 Test Method Color Gray Gray Green Thickness Inches .007 ± .001" .009 ± .001" .009 ± .001" (mm) 0.178 ±0.025 .229 ± .025 .229 ± .025 ASTM D 374 Breaking Strength Lbs/inch
GPD Global | https://www.gpd-global.com/peel-back-force-tester.php?utm_source=dsapril2017&utm_campaign=newsletter&utm_medium=text
) SPC software package. Measures peel force strength of cover tape on SMT component carrier packaging. Correct peel force strength provides compatibility with SMT Pick & Place systems
