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Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
Technic Releases TechniCatalyst AT4608 A New High Performance Palladium Activator for TechniPad ENIG, ENIPIG and ENEPIG Plating ProcessesCranston RI, USA – Technic has announced the release of TechniCatalyst AT4608, a high performance palladium acti
Flake & Powders for die-Attach adhesives and thick film inks. (Silver, Copper, Silver-Palladium, Platinum)
Electronics Forum | Mon Jan 29 12:42:24 EST 2001 | davef
Several points about your query are: * TI�s solderability protection specification is a minimum of 3 u" of palladium over 40-60 u" of nickel plate over a http://www.ti.com/sc/docs/products/logic/package/palladm/index.htm
Electronics Forum | Mon Jan 29 06:44:59 EST 2001 | Scott B
I have recently come across a device which has a palladium over nickel finish which when soldered shows evidence of poor wetting to the lead ( i.e. a wetting angle greater than 90�) about three quarters of the way up the side of lead. This is only vi
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Technical Library | 2012-10-11 19:50:09.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper shows the benefits by using a pure palladium Layer in the ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) and ENEP (Electroless Nickel, Electroless P
Technical Library | 2015-03-26 19:16:03.0
Nickel-palladium-gold-finished terminals are susceptible to creep corrosion. Excessive creep corrosion can result in device failure due to insulation resistance loss between adjacent terminals. The mixed flowing gas test has been demonstrated to produce creep corrosion on parts with nickel-palladium-gold finished terminals. Conformal coats are often used to protect printed wiring assemblies from failure due to moisture and corrosion. However, coating may not be sufficient to protect lead terminations from failure.In this study, acrylic, silicone, urethane, parylene, and atomic layer deposit (ALD) coatings were examined for their effectiveness at preventing corrosion of nickel-palladium-gold-finished terminals.
Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_advantages-of-schottky-diode_topic2434.xml
;as in conventional diodes). Typical metals used are molybdenum, platinum, chromium or tungsten, and certain silicides (e.g., palladium silicide and platinum silicide
Heller Industries Inc. | https://hellerindustries.com/nonwetting/
worklife Ambient humidity and temperature beyond paste work envelope A palladium lead finish which requires higher reflow (liquidus) temperature Reflow-related causes of PCB Nonwetting: Peak reflow (liquidus
