Electronics Forum | Mon Sep 11 20:41:09 EDT 2000 | Dave F
Try: * Semiconductor Equipment 5154 Goldman Ave Moorpark CA 93021 805.529.2293 fax 2193 * Palomar ?? (Hughes Aircraft, Technology Products) 2051 Palomar Airport Rd., Carlsbad, CA 92009 619.931.3622 fax5191 Jeff King appl x3629 * Kulicke&Soffa, 201 B
Electronics Forum | Tue Jun 13 13:34:10 EDT 2006 | jsmith01
Does anyone have a Manual for a Hughes/Palomar Htt-1000 power supply and a VTA-96 weld head? I acquired these machines to do a small job that we need to attach a flex cable to a thermal print head. As far as I can tell this division of Hughes was s
Technical Library | 2019-05-21 17:38:55.0
Last month we presented Flip Chip Rework.As promised, this month we follow up with attachment techniques. Flip chip assembly is a key technology for advanced packaging of microelectronic circuits. It allows attachment of a bare chip to a packaging substrate in a face-down configuration, with electrical connections between the chip and substrate via conducting “bumps.” Flip chip technology was first invented by IBM for mainframe computer application in the early 1960s. Semiconductor devices are mounted face down and electrically and mechanically connected to a substrate (Figure 1). IBM called this manufacturing process a C4 process (controlled collapse chip connection).
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