Industry Directory: palomar (4)

Palomar Technologies

Palomar Technologies

Industry Directory | OEM

Palomar speciailizes in complex, high reliability advanced packaging systems and contract assembly services.

New SMT Equipment: palomar (9)

Palomar Hughes 1000 watt second power supply

Palomar Hughes 1000 watt second power supply

New Equipment | Other

Palomar Hughes 1000 watt second power supply $595.00

Hi-Tech Sources

2460-V Automatic Ball Bonder

New Equipment |  

Automatic Ball Bonder for high pin count devices, complex multichip modules, fine-pitch hybrid microcircuits, ceramic circuit boards,Chip-on-board, and Chip-on-flex.

Palomar Technologies

Electronics Forum: palomar (7)

Re: wafer to waffle

Electronics Forum | Mon Sep 11 20:41:09 EDT 2000 | Dave F

Try: * Semiconductor Equipment 5154 Goldman Ave Moorpark CA 93021 805.529.2293 fax 2193 * Palomar ?? (Hughes Aircraft, Technology Products) 2051 Palomar Airport Rd., Carlsbad, CA 92009 619.931.3622 fax5191 Jeff King appl x3629 * Kulicke&Soffa, 201 B

Manual for a Hughes/Palomar

Electronics Forum | Tue Jun 13 13:34:10 EDT 2006 | jsmith01

Does anyone have a Manual for a Hughes/Palomar Htt-1000 power supply and a VTA-96 weld head? I acquired these machines to do a small job that we need to attach a flex cable to a thermal print head. As far as I can tell this division of Hughes was s

Industry News: palomar (8)

SMTA Organizes Two Technical Conferences

Industry News |

Surface Mount Technology Association (SMTA)

2002-02-20 09:09:07.0

Palomar Names VP of Sales and Product Support

Industry News | 2002-05-09 08:48:22.0

Palomar Technologies Inc. has Promoted Jeffrey M. King

Palomar Technologies

Technical Library: palomar (1)

Flip Chip Attach Techniques

Technical Library | 2019-05-21 17:38:55.0

Last month we presented Flip Chip Rework.As promised, this month we follow up with attachment techniques. Flip chip assembly is a key technology for advanced packaging of microelectronic circuits. It allows attachment of a bare chip to a packaging substrate in a face-down configuration, with electrical connections between the chip and substrate via conducting “bumps.” Flip chip technology was first invented by IBM for mainframe computer application in the early 1960s. Semiconductor devices are mounted face down and electrically and mechanically connected to a substrate (Figure 1). IBM called this manufacturing process a C4 process (controlled collapse chip connection).

ACI Technologies, Inc.

Career Center - Resumes: palomar (3)

Bruce L. Barton

Career Center | Poplar Grove, Illinois USA | Management,Production,Quality Control,Technical Support

20+ years in electronic manufacturing, sales support,customer support.

Bruce Barton August 2011

Career Center | Poplar Grove, Illinois | Engineering,Production,Quality Control,Technical Support

Please see resume.

Express Newsletter: palomar (4)

Partner Websites: palomar (7)

Membership Directory Results

Surface Mount Technology Association (SMTA) | https://www.smta.org/directory/suppliers.html

     Palomar Technologies   Carlsbad, CA      PalPilot International Corporation   Englewood, CO      Panasonic   Rolling Meadows, IL 60008, IL      PARMI USA INC.   San Diego, CA      PCB Connect Inc.   Sharon, MA      PCBA Supplies   Anna, TX

Surface Mount Technology Association (SMTA)


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